Realization of high output and long lifespan for LD modules.
This is an announcement from Technisco Co., Ltd. regarding the "Cross Edge Micro Machining [Micro Channel Cooler]."
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basic information
【Features】 ○ Compatible with 120W class LD ○ Achieves a thermal expansion coefficient (CTE) of 8ppm/℃ → Eliminates the need for a submount, allowing for direct mounting of the LD element ○ Enables longer lifespan for LD modules ・ Controls the CTE of the LD bonding area ・ Improves corrosion resistance by gold plating the internal flow paths ○ Gold-tin (AuSn) deposition treatment on the LD bonding area ○ Co-developed with the Fraunhofer Institute for Laser Technology (ILT), known for its research in laser technology ● For other functions and details, please download the catalog or contact us.
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Applications/Examples of results
【Purpose】 ○ Water-cooled heat sink for high-power semiconductor lasers ● For more details, please contact us.
catalog（2）
Download All Catalogs![Cross Edge Microfabrication Comprehensive Catalog [Latest Edition]](https://image.mono.ipros.com/public/catalog/image/01/d0a/317747/IPROS1997172726713350674.JPG?w=120&h=170)
Company information
We will propose the most suitable solutions that match our customers' requirements, considering quality, cost, and mass production, through our advanced composite processing technology (Cross Edge Micro Machining), which combines five cutting-edge techniques: cutting, grinding, polishing, metalizing, and joining.