Degradation of Encapsulants for LEDs and Countermeasures, as well as Reliability Design and Evaluation Methods
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Degradation of Encapsulating Materials for LEDs and Countermeasures, as well as Reliability Design and Evaluation Methods
★What is the heat generation of LEDs based on emission wavelength!? Trends in the development of the latest high-brightness LEDs!? ★LED lifespan evaluation and reliability design of LED systems!
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【Speaker】 Part 1: Shigeru Koshibe, President of Aipack Co., Ltd. Part 2: Shuichi Kanamori, TechnoLog Co., Ltd. 【Venue】 Industrial Promotion Hall, Conference Room 2 【Kanagawa, Kawasaki】 【Date and Time】 June 28, 2010 (Monday) 12:30 PM - 4:15 PM
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Part 1: Degradation of Encapsulation Materials for LEDs and Countermeasures - Resin Encapsulation for High Heat Generation LEDs - [12:30-14:30] 1. LED 2. Applications of LEDs 3. LED Encapsulation Technology 4. Fundamental Issues of LEDs 5. Challenges of White LEDs 6. Challenges of Generalizing LEDs Part 2: Lifespan of LEDs and Reliability Design and Evaluation Methods for LED Systems [14:45-16:15] 1. Characteristics of LED Reliability 2. LED Lifespan Evaluation and Reliability Design of LED Systems 3. Heat Generation of LEDs and Thermal Resistance Evaluation ■ Topics Available for Consultation with the Instructor Reliability Evaluation Techniques: Arrhenius Model, Activation Energy, Lifespan Evaluation, Failure Rate Evaluation Thermal Resistance Measurement Techniques: Estimation Methods for Junction Temperature, Transient Thermal Resistance Measurement, Theoretical Background of K-Factor Failure Physics of LEDs: Luminous Flux Degradation Mechanisms, Color Variation, Temperature and the Electrical and Optical Characteristics of LEDs
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