Film formation technology and equipment for various applications using high-speed sputtering.
S00924
New members who apply for the first time by September 3 will receive an early bird discount price of 42,000 yen.
【Speaker】 Mr. Yoshiyuki Kadokura, Director of the Sixth Research Department, Semiconductor Electronics Research Institute, ULVAC, Inc. Mr. Hiroyasu Kojima, Representative Director of Earth Tech, Visiting Associate Professor at Nagoya University 【Venue】 Comprehensive Community Center, 3rd Floor, Conference Room 1, Kawasaki City, Kanagawa 【Date and Time】 September 14, 2010 (Tuesday) 13:00 - 16:15
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Part 1: Improvement Measures from the Perspective of Sputtering Fundamentals and Equipment 1. Fundamentals of Sputtering 2. Improvements and Evolution of Sputtering Equipment 3. Improvement of Film Thickness Distribution 4. Improvement of Step Coverage 4-1. Requirements for Step Coverage Improvement 4-2. Reasons for the Need for Coverage 4-3. Improvements in Sputtering Methods [Q&A and Business Card Exchange] Part 2: Reactive High-Speed Sputtering and Cathode Technology 1. Fundamentals of Sputtering 2. Types of Reactive High-Speed Sputtering 3. Various Cathode Technologies with Distinct Features 4. Applications of High-Speed Sputtering 4-1. Optical Thin Films 4-2. Barrier Films for Organic EL 4-3. Photocatalytic Films 4-4. ITO Films 4-5. Others [Q&A and Business Card Exchange]
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Applications/Examples of results
★Variation in film thickness distribution due to target usage! ★Optical thin films, barrier films for organic EL, photocatalytic films, ITO films...
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