Basics of high barrier vapor-deposited films and coating technology, functional enhancement, development examples.
S01007
Detailed introduction of vacuum deposition technology, ion plating technology, plasma CVD, binary deposition technology, etc. Also introducing continuous vacuum deposition machines.
【Lecturer】 Yoshifumi Ito, Professor, Doctor of Engineering, Kurume National College of Technology, Department of Applied Biological Chemistry 【Venue】 Kawasaki City Industrial Promotion Hall, Room 5 【Kanagawa, Kawasaki Station】 【Date and Time】 October 28, 2010 (Thursday) 13:00 - 16:30 【Lecture ends at 16:00. 16:00-16:30: Free time Q&A】
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**Lecture Summary** Aluminum vapor-deposited films gained significant market expansion as an alternative to aluminum foil after the oil shock of the 1970s, due to their excellent gas barrier properties, pinhole resistance, light-blocking capabilities, and decorative qualities. On the other hand, transparent vapor-deposited films emerged around the 1990s in response to the dioxin issue, leading to a trend towards dechlorinated films. These films are now forming a large market due to their excellent gas barrier properties, transparency, retort resistance, non-metallic nature, and environmental compatibility. This presentation will explain the characteristics, physical properties, and manufacturing methods of these vapor-deposited films, as well as provide a detailed explanation of vacuum deposition technology, ion plating technology, plasma CVD, binary deposition technology, and continuous vacuum deposition machines that serve as alternatives to conventional batch-type vacuum deposition machines, based on development experiences at Mitsubishi Heavy Industries.
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Content Excerpt↓ 【Program】 1. Basics of High Barrier Packaging Materials 2. Vacuum Thin Film Technology 3. Characteristics and Applications of Aluminum Vapor Deposition Films 4. Characteristics and Applications of Transparent Vapor Deposition Films 5. Environmental Issues and Vapor Deposition Films
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