Laser processing capability, loss improvement through wire length reduction, and heat dissipation improvement by direct mounting of copper plates.
Taclum PLUS, provided by Taconic (USA), is a PTFE substrate for MMIC implementation.
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basic information
【Features】 ○ The linear expansion coefficient is remarkably low, making it ideal for the implementation of GaAs devices. ○ It is very effective in reducing total costs when combined with peripheral circuits. ● For more details, please contact us.
Price information
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Applications/Examples of results
By using laser processing, it is possible to create a "pocket" on the substrate to implement MMICs, enabling wire bonding with the surface copper foil. (Both single-layer and multi-layer options are available.)
Company information
In modern society, the technological innovation and advancement in the information and mobile communications market are remarkable. These applications require cutting-edge technology and devices. Our company was established with the aim of providing world-class devices imported and sold at reasonable prices from around the globe, based on professional staff and a cooperative system with related companies, to offer more detailed technical support to our customers. Furthermore, we will not only provide technical support but also deliver high-quality services, including appropriate technical and design assistance for our customers' actual development projects, assembly, and outsourcing of system development and mass production. Our company was founded with the aspiration to realize a group of genuine professionals who can accurately respond to customer needs in the field of information and mobile communications, guided by the principle of globalization.
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