Development status and market outlook of the 2008 next-generation COF (New Etch/Semi-Additive/Low CTE-PI)
Development Status and Market Outlook of 2008 Next-Generation COF (New Etching/Semi-Additive/Low CTE-PI)
LCD panels have grown the market due to high image quality and low prices. There is also a strong demand for these requirements in related components, and naturally, low cost and high functionality are also required for LDI and COF. To address these somewhat conflicting needs, next-generation COF technology is becoming essential.
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basic information
This report discusses tape substrates that have entered the next-generation COF era. It summarizes the background and trends of their development, as well as the new etching and semi-additive technologies that will become next-generation COF technologies, along with the technological trends of low CTE polyimide films. Additionally, it analyzes the positioning of various COF manufacturers in the current situation and investigates their responses to next-generation technologies, thereby analyzing the overall response to the next-generation COF era. Furthermore, by analyzing the demand trends for next-generation COF, it clarifies the future trends of the COF business.
Price information
150,000 yen
Price range
P3
Delivery Time
P1
Applications/Examples of results
Trends in the development of new etching, semi-additive, and low CTE polyimide film technology: Technical outlook for next-generation COF.
Company information
A market and technology research company specialized in the field of implementation technology: chip mounters, semiconductor assembly equipment, automatic visual inspection, IC packages, BGA/CSP/FC.
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