We manufacture a variety of flat through-hole printed circuit boards.
By filling in only the BGA/CSP section, we are able to flatten the surface mount pads (compatible with 0.35mm pitch) and permanently fill all mini Via holes, among other variations, allowing us to manufacture a wide range of flat through-hole PCBs according to product specifications.
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basic information
【Features】 〇 Flattening of surface mount pads by partial filling only in the BGA/CSP area (supports up to 0.35mm pitch) 〇 Permanent filling of all mini Via holes 〇 Manufacturing of various flat through-hole PCBs according to product specifications ● For other functions and details, please contact us.
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Applications/Examples of results
【Applications】 〇 Printed circuit boards (multilayer boards, BGA/CSP high-density boards, flat through-holes, aluminum boards, and other special wiring boards for consumer and industrial use prototype manufacturing) 〇 Laser drawing, CAM editing, precision industrial photography, complete screen printing ● For other functions and details, please contact us.
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Company information
The screen process strives to meet various customer needs by pursuing high quality, high precision, and short delivery times, while also accurately responding to the demand for lower prices. Furthermore, we aim to deliver products that anticipate future directions and contribute to a prosperous future.