Cuts quickly with a clean cutting surface. It can cut without applying pressure to the sample. Ideal for wafer cutting.
While adjusting the weight to maintain balance, the diamond-coated loop wire approaches the sample for precision cutting. Maximum sample size: 50.8mmφ (2”). Equipped with a digital micrometer and a two-axis goniometer as standard. It demonstrates its power in cutting samples made of mixed materials with different hardnesses.
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basic information
This is a cutting device using diamond-coated loop wire. It allows for cutting without load and is ideal for cutting brittle samples such as ceramics.
Price information
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Delivery Time
Applications/Examples of results
Cuts electronic substrates and accurately cuts delicate samples and fragile materials.
Company information
We, Ollie Co., Ltd., always keep in mind to be sincere to everyone, act with passion, and continue to create a shared higher value and an independent corporate culture. We at Ollie strive to be of service in this industry and aim to grow into a trusted company by our customers and business partners, aspiring to jump high.
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