It is a desktop dicing saw.
Easily create samples, set the number of pieces, and perform auto-cutting with PC control. The dedicated software controls the X, Y, and Z axis motors to process the wafer into squares.
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basic information
Maximum sample size: 200x100x25mm (when using a 4-inch wheel) Stage movement distance: X=200, Y=100, Z=100mm
Price information
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Delivery Time
Applications/Examples of results
Wafer cutting
Company information
We, Ollie Co., Ltd., always keep in mind to be sincere to everyone, act with passion, and continue to create a shared higher value and an independent corporate culture. We at Ollie strive to be of service in this industry and aim to grow into a trusted company by our customers and business partners, aspiring to jump high.
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