Vacuum three-dimensional thermal pressurization device
A vacuum three-dimensional thermal pressing device that allows for the attachment of curved surfaces of substrates and panels, as well as bending formation, without causing scratches. 【Features】 ○ Enables isotropic thermal pressing of soft materials without stretching, due to liquid thermal pressing (PAT) in a vacuum. ○ Simultaneous hydraulic pressure from above and below is possible. ○ No upper mold is required, allowing for bonding and packaging. ○ Work size: - φ200 - Pressing force: 5 kN to 50 kN ○ Energy-efficient, lightweight, compact, and easy to operate. ○ Space-saving and easy to transport. ○ Ideal for element encapsulation and packaging substrates. ● For other functions and details, please download the catalog.
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basic information
A vacuum three-dimensional thermal pressing device that allows for the attachment of curved surfaces of substrates and panels, as well as bending formation, without causing scratches. 【Features】 ○ Enables isotropic thermal pressing of soft materials without stretching, due to liquid thermal pressing (PAT) in a vacuum. ○ Simultaneous hydraulic pressure from above and below is possible. ○ No upper mold is required for bonding and packaging. ○ Work size: - φ200 - Pressing force: 5 kN to 50 kN ○ Energy-efficient, lightweight, compact, and easy to operate. ○ Space-saving and easy to transport. ○ Ideal for element encapsulation and packaging substrates. ● For other functions and details, please download the catalog.
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Applications/Examples of results
【Applications】 ○ Bending and embossing of FPCs and films ○ Bonding to R-curved surfaces ○ Film epoxy resin sealing (packaging) for Si devices
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