High-precision laser drilling device (UV) with a minimum beer diameter of 5μm or more.
Photonics Systems Group DR3010
Next-gen drilling for ABF and BT substrates. Achieve 5μm vias with ±5μm precision. Ideal for high-density AI chip packaging.
The micromachining by Photonics Systems Group (PSG) is a cutting-edge laser drilling solution designed for the next generation of high-density interconnects (HDI) and advanced semiconductor packaging. As AI and high-performance computing (HPC) drive the need for extreme miniaturization, this system delivers the capability to drill ultra-fine microvias as small as 5μm in diameter. Optimized for advanced dielectric materials such as ABF (Ajinomoto Build-up Film), BT resins, and specialized glass substrates, it ensures clean, high-aspect-ratio holes with zero debris and minimal thermal impact. Equipped with a high-resolution vision system and ultra-fast galvanometer scanners, the system maintains a positioning accuracy of ±5μm. This level of precision is essential for the reliable fabrication of multi-layer substrates used in advanced IC packaging, where alignment between layers is critical for yield and performance.
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basic information
[Processing Capabilities] Minimum Via Diameter: 5 µm (depending on material and thickness). Positioning Accuracy: ±5 µm (supported by real-time vision alignment). Drilling Type: Blind Vias, Through-Hole Vias (THV), and Micro-drilling. [Advanced Technology] Laser Source: High-stability pulsed laser optimized for organic and inorganic thin films. Optics: High-speed, high-precision scanning head for maximum throughput. Vision System: Integrated 5.1MP camera for sub-micron fiducial recognition and scaling compensation. [Material Compatibility] Substrates: ABF, BT, Polyimide (PI), Rogers, and ultra-thin Ceramic/Glass. Maximum Panel Size: Flexible configurations for various substrate formats. [Control System] Platform: Beckhoff TwinCAT 3 (Full Industry 4.0 compatibility). Software: Supports complex Gerber and DXF data for rapid prototyping and mass production.
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Applications/Examples of results
[Key Applications] AI & HPC Packaging: Microvia drilling for high-layer-count IC substrates and interposers. Smartphones & Wearables: Ultra-high-density HDI boards for compact mobile electronics. 5G/6G Modules: High-frequency substrates requiring precise dielectric processing. Medical Electronics: Precision micro-holes for sensors and implantable devices. [Proven Global Success] With over 2,900 systems installed worldwide, the Photonics Systems Group is the industry benchmark for high-precision laser micromachining. Our systems are the primary choice for global Tier-1 electronics manufacturers and semiconductor giants who require zero-defect manufacturing and the highest possible yield. By integrating PSG’s 5μm drilling technology, manufacturers can push the boundaries of current substrate design and lead the transition into the next era of semiconductor integration.
Detailed information
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ABF Percussion Drilling of 15 µm Vias
Line up（1）
| Model number | overview |
|---|---|
| DR3000 | Pico-second green laser used - Beer size >20 µm |
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Company information
Worldlink LLC Founded in 2022, Worldlink LLC is a professional industrial agency based in Osaka, Japan. Founder Mr. Peter has 23 years of professional experience in the semiconductor, solar energy, lithium battery and automation industries. The company has signed official agency cooperation agreements with German enterprises TSK, Photonics-Systems-Group, Ekvip Automation and Chinese enterprise Beijing Nanotop electronic Technology. WorldLink focusing on providing partners with Japanese market development, business connection and localized operation services.
