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  3. World Link LLC
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World Link LLC

capital600Ten thousand
addressOsaka/Ikeda-shi/Asahi Hill 1-4-7
phone070-8520-6687
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last updated:Apr 18, 2026
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World Link LLC Product Lineup

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New Generation Laser Depaneling

Cleanliness, high work efficiency, reduction of operational costs.

The new generation laser depaneling device developed by PSG (Photonics-Systems-Group) is designed with cleanliness, high efficiency, and low operating costs as core concepts. It is optimal for high-precision, stress-free cutting processes for printed circuit boards and flexible substrates, serving as a next-generation solution to replace traditional mechanical router processing.

  • Circuit board processing machine

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Höllmüller OSP System by TSK

No harmful chemicals. Low cost. Eco-friendly. Organic protective coating that preserves solderability through long-term storage.

The Höllmüller OSP system by TSK applies a thin organic protective layer (Organic Solderability Preservative) to PCB copper surfaces. The process uses no harmful chemicals, making it one of the most environmentally friendly final finish options available. The protective layer is applied uniformly, then dried and cured to ensure consistent coating strength. Excellent solderability is maintained even after long-term storage and before assembly. Low material costs and minimal waste treatment expenses reduce both environmental impact and production costs. TSK Schill, certified to TÜV SÜD WHG standards, manufactures customized system modules with wastewater-reducing circuits and low-noise design. Distributed in Japan by World Link LLC.

  • Circuit board processing machine

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Chemical Tin System|Höllmüller by TSK

Uniform tin coating for oxidation-free copper. Boost solderability, conductivity & RoHS compliance in one final finish step.

The Höllmüller Chemical Tin system by TSK applies an electroless tin plating finish to the copper surfaces of printed circuit boards. A controlled chemical reaction with tin salt solution deposits a uniform tin layer that protects copper from oxidation and corrosion. Precise control of temperature, processing time, and bath concentration ensures consistent layer thickness and quality. The modular design integrates pre-cleaning through final rinse in a single line, enabling easy integration into existing production environments. Manufactured by TÜV SÜD WHG-certified TSK Schill, with wastewater-reducing circuits and low-noise design. World Link LLC provides Japanese-language coordination for installation and after-sales support.

  • Circuit board design and manufacturing

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Laser Trimmer for Electronics & Sensors|LT50x0

Real-time electrical feedback meets laser ablation precision. Eliminate resistor variance in thick & thin film hybrid circuits.

The LT50x0 series by Photonics Systems Group (PSG) is a high-precision laser trimming system designed to adjust resistance values and electrical properties of electronic components, sensors, and hybrid circuits in real time. During processing, the circuit is continuously monitored via a probe card connected to the system's integrated measurement unit. The laser ablation stops automatically once the target value is reached. The non-contact, wear-free process produces no residue or mechanical stress. Multiple laser sources (UV, IR) support both thick and thin film materials. Open software architecture enables integration of third-party hardware and custom algorithms. Flexible automation from stand-alone to fully inline configurations. Backed by PSG's track record of 2,000+ successfully implemented machine projects worldwide.

  • Other semiconductor manufacturing equipment

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High-Precision DES Line | Develop-Etch-Strip Solution

Total wet-process solution for 1-mil L/S. Eliminates the puddle effect. High-yield production for advanced IC substrates and HDI.

The Höllmüller DES Line by TSK Schill is a fully integrated, horizontal wet-chemical solution for Developing, Etching, and Stripping. Specifically engineered for the next generation of ultra-fine line circuit formation, this line provides a seamless and high-yield process for advanced PCB and PCM manufacturing. The system's core advantage is its ability to physically eliminate the "puddle effect" (chemical stagnation) on the substrate surface. Through TSK’s proprietary fluid dynamics and oscillation spray technology, it achieves absolute uniformity and repeatability across large panels and ultra-thin materials. This enables reliable mass production of fine-line circuit patterns down to 1-mil (25μm) definitions. Built with a robust 15mm thick high-quality polypropylene (PP) structure, the DES line is designed for 24/7 industrial durability. It integrates the legacy of Höllmüller’s 40+ years of expertise with modern Beckhoff TwinCAT 3 control systems, providing a future-proof foundation for high-end server-grade PCBs and AI semiconductor packaging.

  • Circuit board processing machine

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Etching machine for difficult-to-cut materials like titanium | Hydrogen energy, medical, aerospace

Supports aviation, medical, and fuel cell applications. Achieves high-precision titanium surface processing using hydrofluoric acid control technology, with a focus on safety and environmental considerations.

The titanium etching system developed and manufactured by TSK Schill GmbH is a horizontal wet processing device designed for the precise and safe machining of titanium materials, which possess high strength and corrosion resistance. By precisely controlling the chemical reaction between hydrofluoric acid and the titanium surface, it achieves the removal of the oxide layer and the formation of microstructures. By strictly managing the etching time, temperature, and acid concentration, it consistently achieves the desired surface finish. It directly contributes to improving coating adhesion, enhancing corrosion resistance, and extending product lifespan.

  • Other processing machines
  • Etching Equipment

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TwinCAT3 compatible software "cinnamon" that reduces man-hours by 80%

Breaking the 'reinvention of the wheel.' Originating from Germany, HMI auto-generation and node-based control. Cost reduction through multi-vendor development that is not tied to specific manufacturers.

【Advanced Automation Technology from Germany to Japan】 Our company is the official Japanese contact for the German company ekvip. This product features an innovative framework that modularizes the "brain (control logic)" of the equipment, designing it separately from the hardware. 【Overwhelming Benefits of Implementation】 1. 80% Reduction in Development Time: HMI is dynamically auto-generated from PLC structure. This dramatically shortens the time for screen creation, allowing you to focus on the original machine function development. 2. Escape from Vendor Lock-in: By utilizing an abstract design that does not depend on specific manufacturers, it flexibly accommodates component changes and multi-vendor configurations, reducing procurement risks and costs. 3. High Future Asset Value: The accumulated logic can be reused even when machines are replaced, preventing the "reinvention of the wheel" for each project. 【Support as the Japanese Contact Point】 "Technical details are handled by engineers in Germany, while business consultations are conducted with our company in Japan." Implementation is managed by professionals from the home country, and we coordinate smooth communication. We ensure a reliable implementation with a global system available 24/7, 365 days a year.

  • Other embedded systems (software and hardware)
  • Development support tools (ICE, emulators, debuggers, etc.)

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Horizontal transport PTH device | Uniform processing of high aspect ratio vias and yield improvement

Uniform electroless copper plating even with adjacent holes of different sizes. Prevents residue with 10μm filtration and optimal fluid control, ensuring stable transport of ultra-thin materials. Ideal for HDI substrates.

"Mastering Through-Hole Technology for High-Density HDI Board Connection Reliability" Höllmüller PTH by TSK provides maximum yield for high aspect ratio holes and vias in increasingly miniaturized HDI and multilayer boards. - Uniform Liquid Replacement and Processing Quality Even in complex layouts with adjacent large and small holes, our unique fluid control achieves uniform processing within all vias. This fundamentally supports connection reliability in the electroless copper plating process. - Stable Transport of Ultra-Thin Materials We have established a system that can stably transport ultra-thin materials, which are prone to damage, without wrinkles or folds. - Thorough Contamination Management (10μm Filtration) Equipped with an inline 10-micron cartridge filter. This enhances the cleanliness of the chemicals and thoroughly eliminates fine residues that can cause plating defects. - High Durability and Maintenance Design The main body adopts a robust PP (polypropylene) structure with a thickness of 15mm. Each module is equipped with a glass cover, balancing visibility of operational status and ease of maintenance.

  • Circuit board processing machine

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Laser processing machine for DCB/AMB substrates | Minimum hole diameter 30μm, accuracy 5μm

Achieves a minimum hole diameter of 30μm and a machining accuracy of ±5μm. Suppresses thermal effects on DCB and AMB substrates with a picosecond laser. For cutting, drilling, and pattern formation.

【The Definitive Solution for Heat Dissipation Substrate Processing for Next-Generation Power Semiconductors】 The CR20x0 series is the latest laser system from German company PSG, specialized in the precision processing of DCB (Direct Copper Bonding) and AMB (Active Metal Brazing) substrates, which are essential for power electronics. ■ Pico-Second Laser Processing Pursuing "Zero Thermal Damage" By employing ultra-short pulse lasers, thermal effects on ceramic and copper composite materials are minimized to the extreme. It prevents "cracks," "burrs," and "delamination" that could not be avoided with physical cutting tools or long-pulse lasers, ensuring a high-quality finish. ■ Overwhelming Processing Specifications Minimum Hole Diameter 30μm: Capable of processing extremely small vias with high circularity. Processing Accuracy ±5μm: Maintains extremely high positional accuracy over a wide range due to all-axis linear motor drive and high-resolution glass scales. Compatible with a Variety of Materials: Proven high performance with various ceramic materials such as Al2O3, AlN, and Si3N4.

  • Circuit board processing machine

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High-Precision Horizontal Desmear System | Höllmüller DESMEAR

Perfect smear removal for high-aspect-ratio vias. Optimized for ultra-thin substrates with advanced horizontal transport technology.

The Höllmüller DESMEAR by TSK Schill is a premier horizontal wet chemical system designed for the critical Desmear and Surface Conditioning process in PCB and HDI manufacturing. It is specifically engineered to remove resin residues (smear) generated during laser drilling, ensuring 100% reliability for subsequent plating steps. The system’s advanced fluid dynamics provide intensive chemical exchange even within small, high-aspect-ratio blind vias and through-holes. This uniform treatment ensures superior adhesion for electroless copper, which is vital for high-reliability automotive and server boards. Furthermore, TSK’s specialized horizontal conveyor system is world-renowned for its ability to transport ultra-thin and flexible substrates without damage or tension. Built with a robust 15mm thick polypropylene (PP) structure, the system delivers 24/7 industrial durability in the most aggressive chemical environments.

  • Printed Circuit Board

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High-Efficiency Stripping System | Residue-Free Resist Removal

Advanced horizontal stripping for PCB/PCM. High-impact spray ensures zero resist residue even in high aspect ratio structures.

The Höllmüller STRIP by TSK Schill is a high-performance horizontal stripping system designed for the complete and uniform removal of photoresists from PCBs and various metal surfaces. A key challenge in fine-circuit manufacturing is ensuring that no micro-residues are left behind, which can lead to defects in subsequent processes. This system utilizes advanced spray technology and an integrated recovery unit to rapidly and effectively remove stripped resist. By overcoming the "puddle effect" through optimized fluid dynamics, it ensures consistent chemical interaction across the entire substrate surface, delivering a perfectly clean finish even for complex, high-density designs. The system is engineered for 24/7 industrial durability, featuring a robust 15mm thick polypropylene (PP) structure. It is the trusted solution for high-volume production of advanced electronics where zero-defect reliability is mandatory.

  • Circuit board processing machine

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High-Precision Developing System | 15μm Fine-Line Capability

Ultra-fine 15/15μm resolution for HDI & IC substrates. Advanced spray technology ensures residue-free, uniform development.

The Höllmüller DEVELOP by TSK Schill is a high-end horizontal developing system specifically engineered for the fabrication of ultra-high-density interconnects (HDI) and advanced IC substrates. To achieve the industry-demanding 15μm / 15μm (Line/Space) resolution, the system utilizes TSK’s proprietary high-pressure spray manifold and precise fluid dynamics. This configuration effectively eliminates the "puddle effect" (chemical stagnation), ensuring that unexposed dry film or liquid resist is removed with absolute uniformity across the entire substrate—even within high-aspect-ratio features. Constructed with a heavy-duty 15mm thick polypropylene (PP) frame, this system is built for 24/7 industrial durability. It provides the process stability required for mass-producing next-generation smartphone boards, AI semiconductor carriers, and high-precision medical electronics.

  • Circuit board processing machine

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High-precision laser drilling device (UV) with a minimum beer diameter of 5μm or more.

Next-gen drilling for ABF and BT substrates. Achieve 5μm vias with ±5μm precision. Ideal for high-density AI chip packaging.

The micromachining by Photonics Systems Group (PSG) is a cutting-edge laser drilling solution designed for the next generation of high-density interconnects (HDI) and advanced semiconductor packaging. As AI and high-performance computing (HPC) drive the need for extreme miniaturization, this system delivers the capability to drill ultra-fine microvias as small as 5μm in diameter. Optimized for advanced dielectric materials such as ABF (Ajinomoto Build-up Film), BT resins, and specialized glass substrates, it ensures clean, high-aspect-ratio holes with zero debris and minimal thermal impact. Equipped with a high-resolution vision system and ultra-fast galvanometer scanners, the system maintains a positioning accuracy of ±5μm. This level of precision is essential for the reliable fabrication of multi-layer substrates used in advanced IC packaging, where alignment between layers is critical for yield and performance.

  • Circuit board processing machine

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Laser Depaneling System | Stress-free & Dust-free Singulation

±20μm precision. Zero mechanical stress prevents cracks in automotive/medical PCBA. Significant yield improvement over routing.

The depaneling by Photonics Systems Group (PSG) is a high-end laser singulation solution designed for mission-critical electronics in automotive, medical, and industrial sectors. Unlike traditional routing or dicing, our non-contact laser process eliminates mechanical stress, preventing micro-cracks in sensitive components like ceramic capacitors and avoiding short-circuit risks from glass fibers or debris. With a cutting accuracy of ±20μm, it allows for ultra-narrow kerf widths, significantly increasing panel yield by over 20% in various use cases—leading directly to material cost optimization. Furthermore, the system ensures high technical cleanliness (compliant with international standards such as ISO 16232). By minimizing particle generation, it reduces the burden of post-process cleaning and enhances the long-term reliability of high-density boards. Engineered with German precision and powered by Beckhoff TwinCAT 3 for seamless automation, the depaneling.S ensures stable 24/7 operation. It is the new standard for improving both manufacturing yield and quality assurance.

  • Circuit board processing machine

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Horizontal PCB Etching System | Höllmüller by TSK

Advanced horizontal etching for PCB/PCM. VACU-Etch technology ensures 1-mil line uniformity by eliminating the puddle effect.

The Höllmüller ETCH by TSK Schill is a premier horizontal etching solution specifically engineered for high-end PCB and PCM (Photochemical Machining) production. It is designed to handle the most rigorous requirements for fine-line circuit formation. The system’s defining feature is the proprietary VACU-Etch technology. By optimizing fluid dynamics and using a vertical oscillation spray system, it physically eliminates the "puddle effect" (chemical stagnation) on the substrate surface. This allows for a perfectly uniform etch across the entire panel, enabling stable mass production of 1-mil (25μm) line/space definitions. Built with a robust 15mm thick polypropylene (PP) structure, the Höllmüller ETCH provides exceptional chemical resistance and thermal stability. It is the definitive choice for manufacturers of HDI boards, IC substrates, and high-precision metal parts who cannot compromise on yield or quality.

  • Etching Equipment

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World Link LLC Business Introduction

"I want to increase uniformity more," "It's inevitable that liquid unevenness occurs with ultra-thin materials," such concerns can be resolved all at once!

Our company provides services as the domestic agent for "TSK SCHILL GmbH," a manufacturer of PCB (printed circuit board) manufacturing equipment, and "Photonics Systems Group," a manufacturer of laser equipment. We offer overwhelming support speed that can only be realized in Japan. We have the agility to "respond to customer inquiries on the spot." With the precise perspective cultivated as engineers and a network built across the globe, we will engage in honest business practices. 【Business Activities】 ■ Agency services for overseas semiconductor and PCB equipment manufacturers (TSK Schill GmbH, Photonics Systems Group) ■ iPhone repair services and sales of iPhone cases ■ Operation of an online shop ■ Purchase and sale of used iPhones (purchase of junk items → sale of parts) ■ Planning and sales of drones ■ VISA-related services *For more details, please download the PDF or feel free to contact us.

  • Other semiconductor manufacturing equipment
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  • 展示会出展等の販売促進に必要な費用を助成します! 最大300万円 助成率1/2以内 市場開拓助成事業 展示会等参加費・印刷物制作費・動画制作費 など 申請受付:令和8年 5/15(金)~5/29(金)
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