Total wet-process solution for 1-mil L/S. Eliminates the puddle effect. High-yield production for advanced IC substrates and HDI.
The Höllmüller DES Line by TSK Schill is a fully integrated, horizontal wet-chemical solution for Developing, Etching, and Stripping. Specifically engineered for the next generation of ultra-fine line circuit formation, this line provides a seamless and high-yield process for advanced PCB and PCM manufacturing. The system's core advantage is its ability to physically eliminate the "puddle effect" (chemical stagnation) on the substrate surface. Through TSK’s proprietary fluid dynamics and oscillation spray technology, it achieves absolute uniformity and repeatability across large panels and ultra-thin materials. This enables reliable mass production of fine-line circuit patterns down to 1-mil (25μm) definitions. Built with a robust 15mm thick high-quality polypropylene (PP) structure, the DES line is designed for 24/7 industrial durability. It integrates the legacy of Höllmüller’s 40+ years of expertise with modern Beckhoff TwinCAT 3 control systems, providing a future-proof foundation for high-end server-grade PCBs and AI semiconductor packaging.
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basic information
[Integrated Processes] DEVELOP: Precision developing for dry film, liquid resist, and solder masks. ETCH: High-uniformity etching (VACU-Etch) compatible with alkaline or acid etchants. STRIP: Efficient removal of resist residues with integrated cleaning systems. [Technical Performance] Fine Line Capability: Reliable 1-mil (25μm) space/trace formation. Uniformity: Advanced fluid control ensures 2–10% etching variation across the panel. Resource Efficiency: Optional in-line recycling units available to minimize chemical waste and operational costs. [Build & Maintenance] Structure: Heavy-duty 15mm reinforced Polypropylene (PP) or PVDF housing. Maintenance: Tool-less "Bayonet" spray bars for rapid cleaning and maximized uptime. Control Platform: Advanced Industrial PLC Control (Siemens S7-1500 etc.) for precise parameter management and stability.
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Applications/Examples of results
[Primary Applications] Next-Gen Packaging: Circuit formation for AI chip substrates and high-performance server PCBs. Power Electronics: Precision etching for high-heat dissipation DCB/AMB substrates. High-Density HDI: Reliable mass production for 5G/6G communication devices and EV electronics. [Proven Global Success] TSK Schill (Höllmüller legacy) is the global benchmark for horizontal wet processing, with an installed base of over 900 Etching, 600 Developing, and 750 Stripping systems worldwide.
Company information
Worldlink LLC Founded in 2022, Worldlink LLC is a professional industrial agency based in Osaka, Japan. Founder Mr. Peter has 23 years of professional experience in the semiconductor, solar energy, lithium battery and automation industries. The company has signed official agency cooperation agreements with German enterprises TSK, Photonics-Systems-Group, Ekvip Automation and Chinese enterprise Beijing Nanotop electronic Technology. WorldLink focusing on providing partners with Japanese market development, business connection and localized operation services.
