Achieving both high precision and flexibility. The new generation "DR20x0 / DR30x0" series is born.
The new generation of PSG "DR20x0 / DR30x0" realizes the optimal solution for advanced PCB packaging: 1. ABF substrate drilling 2. Ultra-HDI PCB fine drilling 3. IC substrate drilling 4. Rigid substrate processing 5. Cavity creation 6. Laser trenching
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basic information
DR20X0 DR30X0
Price range
Delivery Time
Applications/Examples of results
1. ABF substrate drilling 2. Ultra-HDI PCB drilling 3. IC substrate drilling 4. Rigid substrate processing 5. Cavity creation 6. Laser trenching
Company information
WorldLink Co., Ltd. Founded in 2022, WorldLink Co., Ltd. is a professional industrial agency based in Osaka, Japan. Founder Mr. Peter has 23 years of professional experience in the semiconductor, solar energy, lithium battery and automation industries. The company has signed official agency cooperation agreements with German enterprises TSK, Photonics-Systems-Group, Ekvip Automation and Chinese enterprise Beijing Nanotop electronic Technology. WorldLink focusing on providing partners with Japanese market development, business connection and localized operation services.
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