We will exhibit the "turntable substrate cutting machine" that allows parallel setup during substrate cutting and the "laser substrate marking device" that can handle a wide range of materials!
Under the theme of "Solutions that contribute to solving challenges in the production field," we will be showcasing the "Router-type Turntable Circuit Board Cutting Machine" and the "Laser-type Circuit Board Marking Device." The "Router-type Turntable Circuit Board Cutting Machine" is a device that allows for parallel setup during circuit board cutting, which is expected to improve productivity. At this exhibition, we will be able to propose a general-purpose inline specification utilizing robots. The "Laser-type Circuit Board Marking Device" offers high-resolution printing that meets the requirements for traceability of printed circuit boards, including fine printing of two-dimensional codes and characters, as well as compatibility with various materials. Additionally, at the exhibition venue, you will be able to confirm the actual processing quality through demonstrations of circuit board cutting and printing. We look forward to welcoming you to the Meibishi Technica booth on the day of the event.
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basic information
【Exhibition Name】Total Solutions for Electronic Devices Exhibition 2026 (JISSSO PROTEC 2026) 【Dates】June 10, 2026 (Wednesday) to June 12, 2026 (Friday) 10:00 AM to 5:00 PM 【Venue】Tokyo Big Sight, East Hall 1 (Booth No. 1A-31)
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Applications/Examples of results
【Circuit Board Cutting Machine: Features】 - Equipped with two tables using an automatic turn method that allows for parallel setup. - Adaptable to general inline specifications through the use of robots. - Reduction in cutting time achieved by setting the Z-axis height for each router location. - Built-in dust collector enables compact device size. - Allows for the creation of offline cutting programs without stopping the device during production. 【Circuit Board Marking Device: Features】 - Laser heads available in two types: fiber laser and CO2 laser. - Fiber laser accommodates a variety of materials such as metals and ceramics. - Fiber laser offers higher precision printing and longer lifespan, resulting in reduced total costs compared to CO2 laser. - Optional built-in reversing mechanism enables double-sided marking. - Daily inspections can be conducted paperlessly via the device's touch panel screen.
Line up（3）
| Model number | overview |
|---|---|
| MR2535H2T | Turntable-type circuit board separator |
| ML-PM20F3 | Fiber laser substrate marking device |
| ML-PM30C3 | CO2 laser substrate marking device |
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Company information
Since its establishment in 1980, when it was separated from Mitsubishi Electric Nagoya Works in the facilities and materials division, our company has been a member of the Mitsubishi Electric Group. Through various contract operations, we have nurtured our manufacturing capabilities and provided products and services related to various FA and mechatronic equipment to our customers. Moving forward, we will continue to contribute to solving the challenges faced in our customers' production sites by working on improving our comprehensive capabilities in manufacturing, including skill inheritance, production innovation, and quality improvement activities. As a trusted partner to our customers, we will value communication with them and deliver products and services that meet their satisfaction.
