PSG High-Precision Green/UV Laser Drilling and Cutting Device
- Optimized for drilling and routing of flexible substrates, ultra-high-density wiring (ultra-HDI) PCBs, and IC package substrates - Accuracy ±10 μm (3σ) - Wide selection of ultra-short pulse laser light sources available - Infinity Scan: Synchronized operation of galvanometer scanner and stage
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basic information
DR2000 Laser System for PCB Hole Drilling and Routing Versatility and Flexibility: Supports a variety of laser drilling and routing applications for PCBs and IC package substrates High-quality processing with major PCB materials (FR4, PI, CCL, BT, RT, ABF, Rogers, coverlay, ceramics) Positioning accuracy < 10 μm (3σ) Modular on-site upgrades to accommodate future expansions Automation compatible: Easily integrates into fully automated and semi-automated production lines Next-generation ultrashort pulse laser technology: Minimizes heat-affected zones and maximizes process control
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Versatility and Flexibility: Supports diverse laser drilling and routing applications for PCB and IC package substrates. High-quality processing with major PCB materials (FR4, PI, CCL, BT, RT, ABF, Rogers, coverlay, ceramics). Position.
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Worldlink LLC Founded in 2022, Worldlink LLC is a professional industrial agency based in Osaka, Japan. Founder Mr. Peter has 23 years of professional experience in the semiconductor, solar energy, lithium battery and automation industries. The company has signed official agency cooperation agreements with German enterprises TSK, Photonics-Systems-Group, Ekvip Automation and Chinese enterprise Beijing Nanotop electronic Technology. WorldLink focusing on providing partners with Japanese market development, business connection and localized operation services.









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