Advanced horizontal etching for PCB/PCM. VACU-Etch technology ensures 1-mil line uniformity by eliminating the puddle effect.
The Höllmüller ETCH by TSK Schill is a premier horizontal etching solution specifically engineered for high-end PCB and PCM (Photochemical Machining) production. It is designed to handle the most rigorous requirements for fine-line circuit formation. The system’s defining feature is the proprietary VACU-Etch technology. By optimizing fluid dynamics and using a vertical oscillation spray system, it physically eliminates the "puddle effect" (chemical stagnation) on the substrate surface. This allows for a perfectly uniform etch across the entire panel, enabling stable mass production of 1-mil (25μm) line/space definitions. Built with a robust 15mm thick polypropylene (PP) structure, the Höllmüller ETCH provides exceptional chemical resistance and thermal stability. It is the definitive choice for manufacturers of HDI boards, IC substrates, and high-precision metal parts who cannot compromise on yield or quality.
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basic information
[Process Performance] Etching Capability: Supports ultra-fine 1-mil (25μm) space/trace definitions. Uniformity: Achieves industry-leading etching factors (typically 2–10% variation) through VACU-Etch technology. Compatibility: Suitable for alkaline, acid, and ferric chloride etchants. [Technical Features] VACU-Etch System: Ensures rapid chemical exchange to prevent puddling and over-etching. Oscillation Spray: Vertical oscillation of spray bars ensures consistent coverage across the transport direction. Nozzle Design: High-impact nozzles arranged for maximum surface interaction. [Build & Maintenance] Structure: Heavy-duty 15mm reinforced Polypropylene (PP) or PVDF housing. Bayonet Spray Bars: Tool-less removal system for quick cleaning and minimized downtime. Control: Advanced Industrial PLC Control (Siemens S7-1500 etc.) for precise parameter management and stability.
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[Core Applications] High-End Electronics: IC Substrates, FC-BGA, and advanced HDI board manufacturing. Precision Machining: Photochemical Machining (PCM) for ultra-thin metal components. Next-Gen Power: Precise etching of thick copper for power semiconductor modules. [Proven Expertise] TSK Schill (Höllmüller legacy) is a global leader in horizontal wet chemistry, with over 900 etching systems successfully installed worldwide. [Why Höllmüller ETCH?] Our etching systems are recognized globally for their ability to deliver high-yield results where conventional horizontal lines fall short. By combining decades of German engineering with the latest in fluid control, we provide a reliable solution for the industry's shift toward miniaturization and higher density.
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Company information
Worldlink LLC Founded in 2022, Worldlink LLC is a professional industrial agency based in Osaka, Japan. Founder Mr. Peter has 23 years of professional experience in the semiconductor, solar energy, lithium battery and automation industries. The company has signed official agency cooperation agreements with German enterprises TSK, Photonics-Systems-Group, Ekvip Automation and Chinese enterprise Beijing Nanotop electronic Technology. WorldLink focusing on providing partners with Japanese market development, business connection and localized operation services.
