List of Etching Equipment products
- classification：Etching Equipment
1～45 item / All 341 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
We would like to introduce our main products, including the 12-inch automatic rotating etching device!
- Etching Equipment
- Wafer processing/polishing equipment
Ion exchange membrane electrolysis cell that achieves both high-purity oxidant production and gas separation.
- Other recycling systems
- Other surface treatment equipment
- Etching Equipment
Processing speed is 0.6 to 5.0 m/min (variable)! We provide cleaning equipment for organic EL manufacturing lines.
- Other cleaning machines
- Etching Equipment
Automatically mixes the chemical solution and delivers the required amount to the etching tank! It uses a sequencer control method.
- Etching Equipment
Flow spray of 2 mmlit/min or less is possible!
- nozzle
- valve
- Etching Equipment
Notice of Discontinuation of Sales for Sonaer Particle Generators
We would like to inform you that we have received an important notification regarding product supply from Sonia Corporation, as detailed below. ■ Regarding Discontinued Products The following products will be discontinued for sale starting June 1, 2026: • 241TM • VM Module • 241CT • CST • CV • 2.4MHz Crystal This measure has been taken because it has become difficult to sell these products individually due to the soaring manufacturing and procurement costs of gold and fluoropolymer crystals. ■ Conditions for Continued Sales In the future, the 241TM, VM, and 2.4MHz Crystal will only be available for sale to customers who have previously purchased the 241PGT or 241PG. ■ Handling of New 241PGT The new 241PGT will only be provided as replacement parts. It will not be sold for new applications. If you have any questions or concerns regarding this matter, please feel free to contact us. We appreciate your continued support and look forward to serving you.
Advanced horizontal etching for PCB/PCM. VACU-Etch technology ensures 1-mil line uniformity by eliminating the puddle effect.
- Etching Equipment
Supports aviation, medical, and fuel cell applications. Achieves high-precision titanium surface processing using hydrofluoric acid control technology, with a focus on safety and environmental conside...
- Other processing machines
- Etching Equipment
It enables extremely precise flow control, achieving a very low pulsation and smooth flow of liquid.
- Coater
- Etching Equipment
- CMP Equipment
Are you struggling with fading or peeling text on nameplates in harsh outdoor or oil-soaked environments? We offer custom-made, high-durability nameplates produced from a single drawing.
- Etching Equipment
- Nameplate
Expansion to advanced packages: Processing is possible on a 510×515mm substrate.
- Sputtering Equipment
- Etching Equipment
- Annealing furnace
A slim and high-performance syringe pump that simplifies the design of flow path systems and their integration into devices.
- Coater
- Resist Device
- Etching Equipment
![[Tooling-Free Mass Production] Mach...](https://image.mono.ipros.com/public/product/image/2000158412/IPROS4317513488585082420.JPG?w=280&h=280){kind=small}
Fast and flexible low-volume production
- Contract manufacturing
- Etching Equipment
- Engine parts
High-durability PTFE hoses achieve both high flexibility and durability due to their fine wave PTFE structure. They are suitable for chemical supply lines and movable piping sections in semiconductor ...
- hose
- Other semiconductor manufacturing equipment
- Etching Equipment
![[For Semiconductors] High voltage r...](https://image.mono.ipros.com/public/product/image/2074022/IPROS3851412570407366522.jpeg?w=280&h=280){kind=small}
High-pressure resistant PTFE hoses adopt a fine wave PTFE corrugation structure. They achieve both high pressure resistance and low reaction force, making them suitable for high-purity chemical lines ...
- hose
- Other semiconductor manufacturing equipment
- Etching Equipment
UHP/UHV, ultra-high purity, ultra-high vacuum, advanced metal sealing solutions for ultra-low temperature.
- Sealing
- CVD Equipment
- Etching Equipment
Delta Seal (HNV HELICOFLEX(R) DELTA) achieves ultra-high vacuum! [Standardized for JIS V-groove flanges]
- Sealing
- CVD Equipment
- Etching Equipment
[Standardized for JIS V Groove Flange] Low Tightening Pressure Y 'Ultra High Vacuum Delta Seal' for Semiconductor Field
The Delta Seal (HNV HELICOFLEX(R) DELTA) has two delta-shaped protrusions on the contact side of the cross-section. The delta-shaped protrusions are designed to collapse and disappear during the compression of the outer casing when the flange groove is assembled. The design tightening pressure of the Delta Seal is lower compared to the Helicoflex seal, allowing for replacement with elastomer O-rings. Leak rate: *For circular shapes, 10⁻¹² Pa·m³/sec. (10⁻¹¹ atm·cm³/sec.) *Depends on the quality of the installation side. 【Features】 ■Two delta-shaped protrusions on the contact side of the cross-section ■Achieves ultra-high vacuum ■Has excellent elasticity and can be used at high temperatures ■Can be replaced with elastomer O-rings *For more details, please refer to the PDF document or feel free to contact us.
Evaluation of Organic Coatings on Metals Using Electrochemical Measurement Devices Based on ISO 17463 - Paints and Varnishes
- Etching Equipment
- Wafer
- Other surface treatment equipment
![[Case Study] Plasma Analysis of "Pa...](https://image.mono.ipros.com/public/product/image/aec/2000679537/IPROS56625809199193232139.jpeg?w=280&h=280){kind=small}
Introduction to Particle-PLUS Analysis Case: "Plasma Analysis of Dual Frequency CCP" Simulation Case
- Etching Equipment
- Wafer
- Ashing device
Two thin film experimental devices are connected with a load lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load lock.
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
Wafer Annealing Equipment [ANNEAL] Max 1000℃ APC Automatic Pressure Control MFC x3 System Compatible with Φ4 to 6 inch Substrates
Max 1000℃, MFC up to 3 systems, APC pressure control, compatible with substrates from 4" to a maximum of 6", high vacuum annealing device (<5 × 10-7 mbar) [ANNEAL] is a research and development annealing device capable of high-temperature heat treatment of substrates such as wafers in a stable process atmosphere. It allows high-temperature processing up to 1000℃ using a heating stage installed in a high vacuum water-cooled SUS chamber. A heat shield is installed inside the chamber to ensure safety through interlock. The mass flow controller can be expanded to a maximum of 3 systems, enabling firing operations with precisely adjusted process gas pressure (APC automatic process control system option). Additionally, there are many options available, including a front view port, dry scroll pump, special substrate holder, and additional thermocouples. The heating stage inside the chamber has three variations depending on the process gas atmosphere and treatment temperature: - Halogen lamp heater: Max 500℃ - C/C composite heater: Max 1000℃ (in vacuum, inert gas only) - SiC coating heater: Max 1000℃ (vacuum, inert gas, O2)
High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
◆ANNEAL◆ Wafer Annealing Equipment
Max 1000℃, MFC up to 3 systems, APC pressure control, compatible with substrates from 4" to a maximum of 6", high vacuum annealing device (<5 × 10-7 mbar) [ANNEAL] is a research and development annealing device capable of high-temperature heat treatment of substrates such as wafers in a stable process atmosphere. It allows high-temperature processing up to 1000℃ using a heating stage installed in a high vacuum water-cooled SUS chamber. A heat shield is installed inside the chamber to ensure safety through interlock. The mass flow controller can be expanded to a maximum of 3 systems, enabling firing operations at precisely adjusted process gas pressures (APC automatic process control system option). Additionally, there are many options available, including a front view port, dry scroll pump, special substrate holder, and additional thermocouples. The heating stage inside the chamber has three variations depending on the process gas atmosphere and treatment temperature: - Halogen lamp heater: Max 500℃ - C/C composite heater: Max 1000℃ (in vacuum, inert gas only) - SiC coating heater: Max 1000℃ (vacuum, inert gas, O2)
Flexible configuration available upon request for methods such as deposition, sputtering, and EB. Adopts a tall chamber with a height of 570mm, contributing to improved uniformity during deposition.
- Evaporation Equipment
- Sputtering Equipment
- Etching Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
Total support for the installation and maintenance of semiconductor manufacturing equipment, from precision equipment installation compatible with clean rooms! Additional information.
- CVD Equipment
- Etching Equipment
- Resist Device
Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film deposition method. A compact thin-film experimental device that can accommoda...
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as evaporation, sputtering, electron beam (EB) deposition, and annealing.
- Evaporation Equipment
- Sputtering Equipment
- Etching Equipment
◆ANNEAL◆ Wafer Annealing Equipment
Max 1000℃, MFC up to 3 systems, APC pressure control, compatible with substrates from 4" to a maximum of 6", high vacuum annealing device (<5 × 10-7 mbar) [ANNEAL] is a research and development annealing device capable of high-temperature heat treatment of substrates such as wafers in a stable process atmosphere. It allows high-temperature processing up to 1000℃ using a heating stage installed in a high vacuum water-cooled SUS chamber. A heat shield is installed inside the chamber to ensure safety through interlock. The mass flow controller can be expanded to a maximum of 3 systems, enabling firing operations at precisely adjusted process gas pressures (APC automatic process control system option). Additionally, there are many options available, including a front view port, dry scroll pump, special substrate holder, and additional thermocouples. The heating stage inside the chamber has three variations depending on the process gas atmosphere and treatment temperature: - Halogen lamp heater: Max 500℃ - C/C composite heater: Max 1000℃ (in vacuum, inert gas only) - SiC coating heater: Max 1000℃ (vacuum, inert gas, O2)
Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.
- Evaporation Equipment
- Sputtering Equipment
- Etching Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.
- Evaporation Equipment
- Sputtering Equipment
- Etching Equipment
◆ANNEAL◆ Wafer Annealing Equipment
Max 1000℃, MFC up to 3 systems, APC pressure control, compatible with substrates from 4" to a maximum of 6", high vacuum annealing device (<5 × 10-7 mbar) [ANNEAL] is a research and development annealing device capable of high-temperature heat treatment of substrates such as wafers in a stable process atmosphere. It allows high-temperature processing up to 1000℃ using a heating stage installed in a high vacuum water-cooled SUS chamber. A heat shield is installed inside the chamber to ensure safety through interlock. The mass flow controller can be expanded to a maximum of 3 systems, enabling firing operations at precisely adjusted process gas pressures (APC automatic process control system option). Additionally, there are many options available, including a front view port, dry scroll pump, special substrate holder, and additional thermocouples. The heating stage inside the chamber has three variations depending on the process gas atmosphere and treatment temperature: - Halogen lamp heater: Max 500℃ - C/C composite heater: Max 1000℃ (in vacuum, inert gas only) - SiC coating heater: Max 1000℃ (vacuum, inert gas, O2)
High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
Wafer Annealing Equipment [ANNEAL] Max 1000℃ APC Automatic Pressure Control MFC x3 System Compatible with Φ4 to 6 inch Substrates
Max 1000℃, MFC up to 3 systems, APC pressure control, compatible with substrates from 4" to a maximum of 6", high vacuum annealing device (<5 × 10-7 mbar) [ANNEAL] is a research and development annealing device capable of high-temperature heat treatment of substrates such as wafers in a stable process atmosphere. It allows high-temperature processing up to 1000℃ using a heating stage installed in a high vacuum water-cooled SUS chamber. A heat shield is installed inside the chamber to ensure safety through interlock. The mass flow controller can be expanded to a maximum of 3 systems, enabling firing operations with precisely adjusted process gas pressure (APC automatic process control system option). Additionally, there are many options available, including a front view port, dry scroll pump, special substrate holder, and additional thermocouples. The heating stage inside the chamber has three variations depending on the process gas atmosphere and treatment temperature: - Halogen lamp heater: Max 500℃ - C/C composite heater: Max 1000℃ (in vacuum, inert gas only) - SiC coating heater: Max 1000℃ (vacuum, inert gas, O2)
Two thin-film experimental devices are connected with a load-lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load-lock.
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
Wafer Annealing Equipment [ANNEAL] Max 1000℃ APC Automatic Pressure Control MFC x3 System Compatible with Φ4 to 6 inch Substrates
Max 1000℃, MFC up to 3 systems, APC pressure control, compatible with substrates from 4" to a maximum of 6", high vacuum annealing device (<5 × 10-7 mbar) [ANNEAL] is a research and development annealing device capable of high-temperature heat treatment of substrates such as wafers in a stable process atmosphere. It allows high-temperature processing up to 1000℃ using a heating stage installed in a high vacuum water-cooled SUS chamber. A heat shield is installed inside the chamber to ensure safety through interlock. The mass flow controller can be expanded to a maximum of 3 systems, enabling firing operations with precisely adjusted process gas pressure (APC automatic process control system option). Additionally, there are many options available, including a front view port, dry scroll pump, special substrate holder, and additional thermocouples. The heating stage inside the chamber has three variations depending on the process gas atmosphere and treatment temperature: - Halogen lamp heater: Max 500℃ - C/C composite heater: Max 1000℃ (in vacuum, inert gas only) - SiC coating heater: Max 1000℃ (vacuum, inert gas, O2)
We propose specifications that consider cost reduction through wet etching.
- Etching Equipment
The mid-infrared wavelength tunable laser OPPO MIR is a picosecond pulse laser that can be adjusted in the wavelength range of 2.8 to 4.2 µm, with a maximum output of over 1W.
- Etching Equipment
As an automatic device for chemical polishing of thin glass substrates for LCDs, it is suitable for thinning processes up to the G6 generation.
- Other processing machines
- Etching Equipment
- Other surface treatment equipment
High corrosion-resistant and durable rollers suitable for the etching process.
- Etching Equipment
Round hole filters and honeycomb mesh, etc.! You can create freely shaped designs.
- Etching Equipment
Technological capabilities that contribute to the development and practical application of advanced materials.
- Etching Equipment
- Plating Equipment
- Other surface treatment equipment
Design of the arrangement of transport components (rolls) developed independently by our company! Stable transport without corner bends or dents is possible.
- Etching Equipment
We respond to strict requirements for small lots! Etching processing.
- Etching Equipment
Compact yet professional! Reproducing realistic etching tests with a small amount of liquid.
- Etching Equipment
The film is transported to ensure that the load does not exceed a certain value! This achieves high spray efficiency.
- Etching Equipment
A film deposition platform for semiconductor wafers and advanced packaging capable of various film deposition treatments.
- Sputtering Equipment
- Etching Equipment
- CVD Equipment
Providing mass production solutions for high-speed and flexible substrate film deposition applications!
- Sputtering Equipment
- Etching Equipment
Pre-treatment for metal structure inspection will be carried out due to surface corrosion caused by chemicals.
- Other services
- Processing Contract
- Etching Equipment
Flexibility, compact design, and low investment costs! An ideal choice for small-scale production.
- Sputtering Equipment
- Etching Equipment
Extremely low Rc system design in the industry and the highest level of inter-wafer reproducibility!
- Sputtering Equipment
- Etching Equipment