List of Etching Equipment products
- classification：Etching Equipment
1～45 item / All 336 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Ion exchange membrane electrolytic cell that achieves both high-purity oxidant production and gas separation.
- Other recycling systems
- Other surface treatment equipment
- Etching Equipment
Flow spray of 2 mmlit/min or less is possible!
- nozzle
- valve
- Etching Equipment
Start of distribution of 3D CAD data for Sonia Corporation's ultrasonic spray nozzle.
We have started distributing 3D CAD data for the Sonia ultrasonic spray nozzles. Designers and equipment manufacturers can efficiently proceed with equipment design and layout considerations by confirming product shapes and mounting dimensions in advance. This time, we have also released the 3D CAD data for the ultrasonic spray nozzles "WS40K" and "WS130K," which can be used for interference checks and design simulations before implementation. Sonia's ultrasonic spray nozzles cater to a wide range of applications, including precision coating, surface treatment, humidification, and cleaning. By providing 3D CAD data, we support the reduction of design man-hours and the shortening of development periods, facilitating a smooth process from product selection to equipment development.
Two thin-film experimental devices are connected with a load-lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load-lock.
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
[SH Vacuum Substrate Additional High-Temperature Plate Heater_Max 1100℃] For CVD and PVD Vacuum Thin Films
ThermoCera Japan has updated the latest catalog for its ultra-high temperature substrate heating heaters, suitable for thin film experiments such as CVD and PVD, ranging from 1 inch to 4 inches. ◉ Maximum operating temperature: 850°C (SH-IN), 1100°C (SH-BN) We also accommodate requests for customized products such as substrate holders, vertical lift mechanisms, substrate rotation mechanisms, and RF bias. Additionally, we offer heater controllers in both traditional standalone models and 19-inch rack mount options.
High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
【MiniLab】 Evaporation/Sputtering Dual Chamber System
Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)
Two thin film experimental devices are connected with a load lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load lock.
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
【MiniLab】 Evaporation/Sputtering Dual Chamber System
Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)
High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
◆OLED◆ Organic vapor deposition - High-temperature metal evaporation source Max 1500℃
The OLED evaporation source is a high-temperature heating heater for vacuum devices with a maximum operating temperature of 1500°C. It can evaporate materials with high evaporation temperatures, making it suitable for a wide range of applications as a vacuum high-temperature heater and evaporation cell, from low-temperature organic deposition (up to 800°C) cells to high-temperature resistance heating deposition (up to 1500°C) MBE cells. Shutter actuators and water-cooled jackets are also available. High-temperature heaters above 800°C are designed with internal shielding, considering insulation and thermal shielding. 【Main Specifications】 ■ Maximum control temperature: 800°C or 1500°C ■ Operating environment: in vacuum or inert gas (*O2 up to 800°C) ■ Heater: tungsten filament ■ Crucible volume: 1cc (maximum fill volume 1.5cc) ■ Crucible material: alumina ■ Case material: SUS304 or molybdenum ■ Thermocouple: K or C 【Options】 ⚫ Crucible material: PBN, graphite, quartz ⚫ Heater: NiCr wire, Kanthal wire (*for O2) ⚫ Crucible volume: 10cc (maximum fill volume 15cc) ⚫ Shutter: pneumatic or motor-driven ⚫ Water-cooled jacket ⚫ Controller (for heater and shutter control)
High-durability PTFE hoses achieve both high flexibility and durability through a fine wave PTFE structure. They are suitable for chemical supply lines and movable piping sections in semiconductor man...
- hose
- Other semiconductor manufacturing equipment
- Etching Equipment
Flexible configuration available upon request for methods such as deposition, sputtering, and EB. Adopts a tall chamber with a height of 570mm, contributing to improved uniformity during deposition.
- Evaporation Equipment
- Sputtering Equipment
- Etching Equipment
【MiniLab】 Evaporation/Sputtering Dual Chamber System
Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)
![Soft Etching Device [nanoETCH]](https://image.mono.ipros.com/public/product/image/e80/2000071234/IPROS34856758710167043703.jpeg?w=280&h=280){kind=small}
<30W Low power - Etching control precision 10mW Achieving damage-free and delicate etching processing.
- Etching Equipment
■□【PyroMini】□■ Compact High-Performance Infrared Temperature Sensor
High-performance touch panel converter for easy setup, data logging, and data storage on microSD card. The PM2.2 model can also measure glossy metal surfaces. 【Overview】 With a highly visible high-brightness touch panel display, parameters such as temperature range, emissivity, and sampling rate can be intuitively operated and set. Long-term data storage and management are possible with a microSD card. (*An option for a converter without a display is also available.) The compact sensor head, measuring φ18mm x 45mm, allows for temperature measurement in tight spaces. It employs sensors and cables with excellent noise resistance, making it suitable for integration into moving equipment such as robotic arms. The PM2.2 model uses a short wavelength of 2.2um, supporting high temperatures (Max 2000℃) and measurements of glossy metal material surfaces. 【Features】 ◎ Wide range: -20 to 1000℃ (PM), 100 to 2000℃ (PM2.2) ◎ Excellent basic performance: Accuracy ±1%, reproducibility ±0.5%, 240msec fast response ◎ Measurement wavelength range: 8 to 14μm (PM), 2.0 to 2.2μm (PM2.2) ◎ Compact Φ18mm x 45mm
We will solve the shortage of outsourcing partners for precision processing due to capacity overload at existing factories, such as in semiconductors and precision components.
- Etching Equipment
Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.
- Evaporation Equipment
- Sputtering Equipment
- Etching Equipment
【MiniLab】 Evaporation/Sputtering Dual Chamber System
Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)
Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film deposition method. A compact thin-film experimental device that can accommoda...
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
【MiniLab】 Evaporation/Sputtering Dual Chamber System
Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)
Evaluation of Organic Coatings on Metals Using Electrochemical Measurement Devices Based on ISO 17463 - Paints and Varnishes
- Etching Equipment
- Wafer
- Other surface treatment equipment
A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as evaporation, sputtering, electron beam (EB) deposition, and annealing.
- Evaporation Equipment
- Sputtering Equipment
- Etching Equipment
■□【PyroMini】□■ Compact High-Performance Infrared Temperature Sensor
High-performance touch panel converter for easy setup, data logging, and data storage on microSD card. The PM2.2 model can also measure glossy metal surfaces. 【Overview】 With a highly visible high-brightness touch panel display, parameters such as temperature range, emissivity, and sampling rate can be intuitively operated and set. Long-term data storage and management are possible with a microSD card. (*An option for a converter without a display is also available.) The compact sensor head, measuring φ18mm x 45mm, allows for temperature measurement in tight spaces. It employs sensors and cables with excellent noise resistance, making it suitable for integration into moving equipment such as robotic arms. The PM2.2 model uses a short wavelength of 2.2um, supporting high temperatures (Max 2000℃) and measurements of glossy metal material surfaces. 【Features】 ◎ Wide range: -20 to 1000℃ (PM), 100 to 2000℃ (PM2.2) ◎ Excellent basic performance: Accuracy ±1%, reproducibility ±0.5%, 240msec fast response ◎ Measurement wavelength range: 8 to 14μm (PM), 2.0 to 2.2μm (PM2.2) ◎ Compact Φ18mm x 45mm
Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.
- Evaporation Equipment
- Sputtering Equipment
- Etching Equipment
■□【PyroMini】□■ Compact High-Performance Infrared Temperature Sensor
High-performance touch panel converter for easy setup, data logging, and data storage on microSD card. The PM2.2 model can also measure glossy metal surfaces. 【Overview】 With a highly visible high-brightness touch panel display, parameters such as temperature range, emissivity, and sampling rate can be intuitively operated and set. Long-term data storage and management are possible with a microSD card. (*An option for a converter without a display is also available.) The compact sensor head, measuring φ18mm x 45mm, allows for temperature measurement in tight spaces. It employs sensors and cables with excellent noise resistance, making it suitable for integration into moving equipment such as robotic arms. The PM2.2 model uses a short wavelength of 2.2um, supporting high temperatures (Max 2000℃) and measurements of glossy metal material surfaces. 【Features】 ◎ Wide range: -20 to 1000℃ (PM), 100 to 2000℃ (PM2.2) ◎ Excellent basic performance: Accuracy ±1%, reproducibility ±0.5%, 240msec fast response ◎ Measurement wavelength range: 8 to 14μm (PM), 2.0 to 2.2μm (PM2.2) ◎ Compact Φ18mm x 45mm
Processing speed is 0.6 to 5.0 m/min (variable)! We provide cleaning equipment for organic EL manufacturing lines.
- Other cleaning machines
- Etching Equipment
Automatically mixes the chemical solution and delivers the required amount to the etching tank! It uses a sequencer control method.
- Etching Equipment
Advanced horizontal etching for PCB/PCM. VACU-Etch technology ensures 1-mil line uniformity by eliminating the puddle effect.
- Etching Equipment
Supports aviation, medical, and fuel cell applications. Achieves high-precision titanium surface processing using hydrofluoric acid control technology, with a focus on safety and environmental conside...
- Other processing machines
- Etching Equipment
It enables extremely precise flow control, achieving a very low pulsation and smooth flow of liquid.
- Coater
- Etching Equipment
- CMP Equipment
JACLaS EXPO 2026 Exhibition
◆◇◆ We introduce contract development and manufacturing services for diagnostic and medical devices, as well as precision pumps and robotic arms for OEM purposes. ◆◇◆ Tekan utilizes reliable liquid handling and robotic technology to provide a variety of OEM equipment and components in the fields of clinical testing and life sciences. From optimal equipment concept development for the global market to compliance with regulations in various countries and local services, Tekan leverages its extensive resources to provide support. If you have challenges or goals such as the following, please visit the Tekan booth: - You want to develop or improve preprocessing devices or next-generation devices for your current systems. - You want to launch high-quality in-house preprocessing and automated analysis devices. - You want to achieve development that exceeds market expectations through strategic industrial and UI/UX design.
Are you struggling with fading or peeling text on nameplates in harsh outdoor or oil-soaked environments? We offer custom-made, high-durability nameplates produced from a single drawing.
- Etching Equipment
- Nameplate
Expansion to advanced packages: Processing is possible on a 510×515mm substrate.
- Sputtering Equipment
- Etching Equipment
- Annealing furnace
A slim and high-performance syringe pump that simplifies the design of flow path systems and their integration into devices.
- Coater
- Resist Device
- Etching Equipment
JACLaS EXPO 2026 Exhibition
◆◇◆ We introduce contract development and manufacturing services for diagnostic and medical devices, as well as precision pumps and robotic arms for OEM purposes. ◆◇◆ Tekan utilizes reliable liquid handling and robotic technology to provide a variety of OEM equipment and components in the fields of clinical testing and life sciences. From optimal equipment concept development for the global market to compliance with regulations in various countries and local services, Tekan leverages its extensive resources to provide support. If you have challenges or goals such as the following, please visit the Tekan booth: - You want to develop or improve preprocessing devices or next-generation devices for your current systems. - You want to launch high-quality in-house preprocessing and automated analysis devices. - You want to achieve development that exceeds market expectations through strategic industrial and UI/UX design.
![[Tooling-Free Mass Production] Mach...](https://image.mono.ipros.com/public/product/image/2000158412/IPROS4317513488585082420.JPG?w=280&h=280){kind=small}
Fast and flexible low-volume production
- Contract manufacturing
- Etching Equipment
- Engine parts
![[For Semiconductors] High voltage r...](https://image.mono.ipros.com/public/product/image/2074022/IPROS3851412570407366522.jpeg?w=280&h=280){kind=small}
High-pressure resistant PTFE hoses adopt a fine wave PTFE corrugation structure. They achieve both high pressure resistance and low reaction force, making them suitable for high-purity chemical lines ...
- hose
- Other semiconductor manufacturing equipment
- Etching Equipment
UHP/UHV, ultra-high purity, ultra-high vacuum, advanced metal sealing solutions for ultra-low temperature.
- Sealing
- CVD Equipment
- Etching Equipment
Delta Seal (HNV HELICOFLEX(R) DELTA) achieves ultra-high vacuum! [Standardized for JIS V-groove flanges]
- Sealing
- CVD Equipment
- Etching Equipment
[Standardized for JIS V Groove Flange] Low Tightening Pressure Y 'Ultra High Vacuum Delta Seal' for Semiconductor Field
The Delta Seal (HNV HELICOFLEX(R) DELTA) has two delta-shaped protrusions on the contact side of the cross-section. The delta-shaped protrusions are designed to collapse and disappear during the compression of the outer casing when the flange groove is assembled. The design tightening pressure of the Delta Seal is lower compared to the Helicoflex seal, allowing for replacement with elastomer O-rings. Leak rate: *For circular shapes, 10⁻¹² Pa·m³/sec. (10⁻¹¹ atm·cm³/sec.) *Depends on the quality of the installation side. 【Features】 ■Two delta-shaped protrusions on the contact side of the cross-section ■Achieves ultra-high vacuum ■Has excellent elasticity and can be used at high temperatures ■Can be replaced with elastomer O-rings *For more details, please refer to the PDF document or feel free to contact us.
![[Case Study] Plasma Analysis of "Pa...](https://image.mono.ipros.com/public/product/image/aec/2000679537/IPROS56625809199193232139.jpeg?w=280&h=280){kind=small}
Introduction to Particle-PLUS Analysis Case: "Plasma Analysis of Dual Frequency CCP" Simulation Case
- Etching Equipment
- Wafer
- Ashing device
Total support for the installation and maintenance of semiconductor manufacturing equipment, from precision equipment installation compatible with clean rooms! Additional information.
- CVD Equipment
- Etching Equipment
- Resist Device
We propose specifications that consider cost reduction through wet etching.
- Etching Equipment
The mid-infrared wavelength tunable laser OPPO MIR is a picosecond pulse laser that can be adjusted in the wavelength range of 2.8 to 4.2 µm, with a maximum output of over 1W.
- Etching Equipment
As an automatic device for chemical polishing of thin glass substrates for LCDs, it is suitable for thinning processes up to the G6 generation.
- Other processing machines
- Etching Equipment
- Other surface treatment equipment
High corrosion-resistant and durable rollers suitable for the etching process.
- Etching Equipment
Round hole filters and honeycomb mesh, etc.! You can create freely shaped designs.
- Etching Equipment
Technological capabilities that contribute to the development and practical application of advanced materials.
- Etching Equipment
- Plating Equipment
- Other surface treatment equipment
Design of the arrangement of transport components (rolls) developed independently by our company! Stable transport without corner bends or dents is possible.
- Etching Equipment
We respond to strict requirements for small lots! Etching processing.
- Etching Equipment
Compact yet professional! Reproducing realistic etching tests with a small amount of liquid.
- Etching Equipment
The film is transported to ensure that the load does not exceed a certain value! This achieves high spray efficiency.
- Etching Equipment
A film deposition platform for semiconductor wafers and advanced packaging capable of various film deposition treatments.
- Sputtering Equipment
- Etching Equipment
- CVD Equipment
Providing mass production solutions for high-speed and flexible substrate film deposition applications!
- Sputtering Equipment
- Etching Equipment
Pre-treatment for metal structure inspection will be carried out due to surface corrosion caused by chemicals.
- Other services
- Processing Contract
- Etching Equipment