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  2. Electronic Components and Semiconductors
  3. Evatec Japan Ltd.
Electronic Components and Semiconductors
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Evatec Japan Ltd.

EstablishmentJuly 2018
capital1000Ten thousand
number of employees16
addressOsaka/Chuo-ku, Osaka-shi/8th Floor, Matsuzaki Building, 3-1-21 Kitahama
phone06-4708-8750
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last updated:Jul 03, 2026
Evatec Japan Ltd.logo
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  • Products/Services(6)
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Evatec Japan Ltd. Company Overview

Evatec is a global leader in thin film technology, manufacturing deposition equipment needed by major semiconductor manufacturers and research and development institutions around the world.

Evatec's technology has been utilized worldwide for 70 years since the establishment of Balzers AG in 1946. Now, Evatec's thin film manufacturing technology is revolutionizing our lives and ways of working. The Internet of Things (IoT) offers the potential to connect 7 trillion devices for a global population of 7 billion people, and Evatec's thin film manufacturing technology makes this possible. Semiconductor devices manufactured with Evatec's equipment enable millions of people around the world to connect through high-speed wireless networks, changing the way we work due to the evolution of AI. Additionally, autonomous driving made possible by AI semiconductors and high-precision sensing is transforming lifestyles, while power semiconductors allow various devices to operate with less power, addressing energy issues. We provide cutting-edge solutions for thin film manufacturing with high-performance electrical and optical properties, ranging from high-frequency filters essential for wireless communication, high-brightness LEDs for automotive and lighting applications, AI and optoelectronic integrated semiconductors for highly integrated data centers, to touch panels for mobile phones.

Business Activities

Evatec Japan Co., Ltd. was established on July 2, 2018, as the Japanese subsidiary of Evatec, with its headquarters located in Osaka, and is engaged in sales and service activities for Japanese customers. Representative equipment handled: - BAK/Multi BAK (Vacuum deposition system) - LLS EVO II (LL-type vertical sputtering system) - CLUSTERLINE 200/300 (Cluster-type sputtering system for wafers) - CLUSTERLINE 600 (Panel-specific cluster-type sputtering system for advanced packaging) - SOLARIS (Inline ultra-fast sputtering system compatible with various substrates) - HEXAGON (FOUP-compatible inline high-speed sputtering system)

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Products/Services (6)

CLUSTERLINE family - Supporting from wafers to panels. product image
CLUSTERLINE family - Supporting from wafers to panels.
Ultra-high-speed sheet-type sputtering device SOLARIS family product image
Ultra-high-speed sheet-type sputtering device SOLARIS family
Vertical Sputtering Device LLS EVO II product image
Vertical Sputtering Device LLS EVO II
High-speed wafer deposition equipment HEXAGON product image
High-speed wafer deposition equipment HEXAGON

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catalog(6)

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BAK Family

BAK Family

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HEXAGON

HEXAGON

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SOLARIS

SOLARIS

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LLS EVO II

LLS EVO II

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news(1)

evatec-pnl600-e.jpg

Evatec officially enters the next-generation packaging market in Japan with CLUSTERLINE 600 - Expanding business development towards the era of Panel-Level Packaging for AI and HPC.

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Evatec AG (headquartered in Switzerland) is intensifying the deployment of its large panel-compatible coating platform "CLUSTERLINE 600" in the Japanese market and will fully enter the rapidly growing next-generation packaging market for AI (artificial intelligence) and high-performance computing (HPC). In the global semiconductor ecosystem, the transition to new manufacturing architectures such as large interposers, ultra-high-density RDL (Redistribution Layer), glass core substrates, and panel-level packaging is accelerating. In particular, with the increasing size of AI packages, the shift from traditional 300mm wafer-based manufacturing to 600mm class panel processes is gaining attention as a next-generation manufacturing technology. Evatec positions this change as one of the most important growth opportunities in the semiconductor industry over the next decade. By making the CLUSTERLINE 600 its core product, the company aims to expand its advanced packaging business in the Japanese market and support customers' technology development and mass production in areas such as panel-level packaging, advanced IC substrates, and glass core substrates.

Jul 03, 2026

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Detailed information

Company name Evatec Japan Ltd.
number of employees16
Contact addresspostalcode 541-0041 Osaka/ Chuo-ku, Osaka-shi/ 8th Floor, Matsuzaki Building, 3-1-21 KitahamaView on map TEL:06-4708-8750 FAX:06-4708-8735
Key PartnersDomestic and overseas major semiconductor manufacturing equipment manufacturers.
Industry Electronic Components and Semiconductors
Evatec Japan Ltd. Building Image

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