300mm compatible cluster-type sputtering equipment that supports thin wafer transport from WLCSP to FOWLP.
The "CLUSTERLINE 300" is a cluster-type sputtering system designed for 300mm wafers. It features a cluster architecture with cassette-to-cassette processing and fully automated substrate transport. It supports applications such as the transport of thin wafers, backside metallization, packaging applications like WLCSP and FOWLP, and the deposition of soft magnetic films for integrated voltage regulators at 300mm. *For more details, please feel free to contact us.*
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basic information
【Configuration】 ■Compatible substrate: 300mm wafer ■Cassette-to-cassette processing with fully automated transport cluster architecture *For details on configuration options and compatible processes, please contact us.
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Applications/Examples of results
■Thin wafer handling, backside metallization ■Packaging applications such as WLCSP and FOWLP ■Film deposition of soft magnetic films for integrated voltage regulators (300mm)
Company information
Evatec's technology has been utilized worldwide for 70 years since the establishment of Balzers AG in 1946. Now, Evatec's thin film manufacturing technology is revolutionizing our lives and ways of working. The Internet of Things (IoT) offers the potential to connect 7 trillion devices for a global population of 7 billion people, and Evatec's thin film manufacturing technology makes this possible. Semiconductor devices manufactured with Evatec's equipment enable millions of people around the world to connect through high-speed wireless networks, changing the way we work due to the evolution of AI. Additionally, autonomous driving made possible by AI semiconductors and high-precision sensing is transforming lifestyles, while power semiconductors allow various devices to operate with less power, addressing energy issues. We provide cutting-edge solutions for thin film manufacturing with high-performance electrical and optical properties, ranging from high-frequency filters essential for wireless communication, high-brightness LEDs for automotive and lighting applications, AI and optoelectronic integrated semiconductors for highly integrated data centers, to touch panels for mobile phones.
