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  1. Home
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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Sputtering Equipment
  6. Multi-chamber sputtering device

Multi-chamber sputtering device

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STM Series

last updated:May 08, 2020

神港精機 東京支店
神港精機 東京支店
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A lineup with over 20 years of proven history. Customized processes and hardware for high-end niche processes from R&D to mass production.

Actively responding to various applications and substrates that are difficult to accommodate with standard specifications. Dedicated mechanisms are prepared for many substrates, including R&D, discrete components, compounds, MEMS, packaging, assembly processes, masks, and small FPDs. Tray transport of substrates is also standard, enabling film deposition and processing of different types of substrates on the same device through atmospheric substrate handling. In addition to application-specific cathodes (wide erosion, ferromagnetic materials, oxides, reactive types), we support a wide range of applications with special substrate mechanisms (high-temperature heating, magnetic field application, cooling, etc.). Dedicated devices are individually designed based on process tests using in-house demonstration machines.

    Sputtering EquipmentPlasma surface treatment equipment
STM.JPG

Multi-chamber sputtering device

STM.JPG
STM.JPG 6マルチスパッタ外観.jpg 4マルチSP 架台無.jpg
  • Special site - Product/service details - https://pr.mono.ipros.com/shinko-seiki/product/

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basic information

Cluster-type sputtering equipment centered around a transfer chamber. Standard support for both bare substrates and trays (susceptors). Actively compatible with a wide range of substrates including rectangular, small diameter, and irregular shapes. Supports up to 8-inch and equivalent rectangular substrates. Two standard models: hexagonal type and quadrilateral type. Achieves semiconductor-level performance and cleanliness for applications beyond semiconductors. Sputtering equipment for next-generation development.

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Applications/Examples of results

Semiconductor research and development, prototyping Mass production of electronic devices (MEMS, SAW devices, high-frequency devices) Compound semiconductor research and mass production Semiconductor packaging (UBM formation) Prototyping and mass production of high-density mounting substrates Development and prototyping of small-sized FPDs

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Model number overview
Single-Sheet Sputtering Equipment STL Series Adopts the process chamber of the multi-chamber sputtering equipment STM series. Equipped with dedicated cathodes and mechanisms tailored to specific applications. Provides advanced film deposition processes with a simple structure.

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Company information

神港精機

神港精機 東京支店

Industrial Machinery

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Shinko Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.

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