Cluster-type sputtering device for panel-level packaging compatible with panels up to 310×310mm.
The "CLUSTERLINE 310" is a dedicated platform that leverages expertise in processing 300mm wafers and large panels, supporting panel processing of up to 310×310mm. It adopts a cluster architecture equipped with cassette-to-cassette processing and fully automated substrate transport. This is a small panel solution for panel-level packaging, such as for AI chiplets. The first unit was shipped in October 2026. *For more details, please feel free to contact us.*
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basic information
【Configuration】 ■Supported board: Maximum 310×310mm panel ■Cassette-to-cassette processing and fully automated transport cluster architecture *For details on configuration options and supported processes, please contact us.
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Applications/Examples of results
■ Panel Level Packaging (PLP) ■ Advanced Packaging, Small Panel Process for AI Chiplets
Company information
Evatec's technology has been utilized worldwide for 70 years since the establishment of Balzers AG in 1946. Now, Evatec's thin film manufacturing technology is revolutionizing our lives and ways of working. The Internet of Things (IoT) offers the potential to connect 7 trillion devices for a global population of 7 billion people, and Evatec's thin film manufacturing technology makes this possible. Semiconductor devices manufactured with Evatec's equipment enable millions of people around the world to connect through high-speed wireless networks, changing the way we work due to the evolution of AI. Additionally, autonomous driving made possible by AI semiconductors and high-precision sensing is transforming lifestyles, while power semiconductors allow various devices to operate with less power, addressing energy issues. We provide cutting-edge solutions for thin film manufacturing with high-performance electrical and optical properties, ranging from high-frequency filters essential for wireless communication, high-brightness LEDs for automotive and lighting applications, AI and optoelectronic integrated semiconductors for highly integrated data centers, to touch panels for mobile phones.
