The compatible substrate can be processed up to a maximum of φ1 inch! Equipment equipped with a dual gas nozzle.
The "Compact Sputtering Device" is a laboratory high-vacuum thin film deposition system equipped with a 1.3-inch magnetron sputter cathode. It is equipped with an RF power supply with a matching unit for discharge. It features a dual gas nozzle capable of supporting oxidation reaction sputtering. Additionally, it can process substrates up to a maximum diameter of 1 inch. 【Features】 ■ Equipped with a 1.3-inch magnetron sputter cathode ■ Comes with an RF power supply with a matching unit for discharge ■ Features a dual gas nozzle capable of supporting oxidation reaction sputtering ■ Can process substrates up to a maximum diameter of 1 inch *For more details, please refer to the external link page or feel free to contact us.
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【Specifications】 ■ Configuration: Film deposition chamber and exhaust system, gas introduction system ■ Achievable pressure: Below 6.7 x 10^-5 Pa (after 3 hours of exhaust) ■ Substrate size: One 1-inch Si wafer ■ Film thickness distribution: Within ±5% (within φ20mm of 1-inch substrate) ■ Target dimensions: φ25.4mm x 3t (non-magnetic metal materials, etc.) ■ RF output: Maximum 300W with auto-matching ■ Process pressure: 0.1 Pa to 1.0 Pa (Ar gas) *For more details, please refer to the external link page or feel free to contact us.
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【Purpose】 ■Experiment *For more details, please refer to the external link page or feel free to contact us.
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Izumi Tech Co., Ltd. primarily engages in the sale of scientific and physical instruments, and also conducts design and manufacturing activities as a trading company capable of producing goods. We specialize in manufacturing related to new industrial materials, environment, science, physics, electricity, architecture, and civil engineering. Please feel free to contact us if you have any requests.
