Evatec Japan Ltd. List of News Articles

Evatec AG (headquartered in Switzerland) is intensifying the deployment of its large panel-compatible coating platform "CLUSTERLINE 600" in the Japanese market and will fully enter the rapidly growing next-generation packaging market for AI (artificial intelligence) and high-performance computing (HPC). In the global semiconductor ecosystem, the transition to new manufacturing architectures such as large interposers, ultra-high-density RDL (Redistribution Layer), glass core substrates, and panel-level packaging is accelerating. In particular, with the increasing size of AI packages, the shift from traditional 300mm wafer-based manufacturing to 600mm class panel processes is gaining attention as a next-generation manufacturing technology. Evatec positions this change as one of the most important growth opportunities in the semiconductor industry over the next decade. By making the CLUSTERLINE 600 its core product, the company aims to expand its advanced packaging business in the Japanese market and support customers' technology development and mass production in areas such as panel-level packaging, advanced IC substrates, and glass core substrates.