Laser processing machine for DCB/AMB substrates | Minimum hole diameter 30μm, accuracy 5μm
Photonics Systems Group
Achieves a minimum hole diameter of 30μm and a machining accuracy of ±5μm. Suppresses thermal effects on DCB and AMB substrates with a picosecond laser. For cutting, drilling, and pattern formation.
【The Definitive Solution for Heat Dissipation Substrate Processing for Next-Generation Power Semiconductors】 The CR20x0 series is the latest laser system from German company PSG, specialized in the precision processing of DCB (Direct Copper Bonding) and AMB (Active Metal Brazing) substrates, which are essential for power electronics. ■ Pico-Second Laser Processing Pursuing "Zero Thermal Damage" By employing ultra-short pulse lasers, thermal effects on ceramic and copper composite materials are minimized to the extreme. It prevents "cracks," "burrs," and "delamination" that could not be avoided with physical cutting tools or long-pulse lasers, ensuring a high-quality finish. ■ Overwhelming Processing Specifications Minimum Hole Diameter 30μm: Capable of processing extremely small vias with high circularity. Processing Accuracy ±5μm: Maintains extremely high positional accuracy over a wide range due to all-axis linear motor drive and high-resolution glass scales. Compatible with a Variety of Materials: Proven high performance with various ceramic materials such as Al2O3, AlN, and Si3N4.
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basic information
Corresponding materials: DCB, AMB, Al2O3, AlN, Si3N4, ZrO2, LTCC/HTCC Minimum hole diameter: 30μm (when using picosecond laser) Processing accuracy: ±5μm Drive method: High dynamics linear motor Measurement system: High-resolution glass scales on all axes Main applications: Heat dissipation substrates for power semiconductors, processing of high-density circuit boards
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Applications/Examples of results
Successfully achieved through-hole processing with a diameter of 30μm while minimizing the taper (hole inclination).
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Company information
Worldlink LLC Founded in 2022, Worldlink LLC is a professional industrial agency based in Osaka, Japan. Founder Mr. Peter has 23 years of professional experience in the semiconductor, solar energy, lithium battery and automation industries. The company has signed official agency cooperation agreements with German enterprises TSK, Photonics-Systems-Group, Ekvip Automation and Chinese enterprise Beijing Nanotop electronic Technology. WorldLink focusing on providing partners with Japanese market development, business connection and localized operation services.
