Uniform tin coating for oxidation-free copper. Boost solderability, conductivity & RoHS compliance in one final finish step.
The Höllmüller Chemical Tin system by TSK applies an electroless tin plating finish to the copper surfaces of printed circuit boards. A controlled chemical reaction with tin salt solution deposits a uniform tin layer that protects copper from oxidation and corrosion. Precise control of temperature, processing time, and bath concentration ensures consistent layer thickness and quality. The modular design integrates pre-cleaning through final rinse in a single line, enabling easy integration into existing production environments. Manufactured by TÜV SÜD WHG-certified TSK Schill, with wastewater-reducing circuits and low-noise design. World Link LLC provides Japanese-language coordination for installation and after-sales support.
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basic information
・Process: Electroless tin plating (chemical deposition) ・Application: Final finish for PCB and HDI substrates ・Layer control: Precise temperature, time & bath concentration management ・Filtration: Full inline filtration 1–10 µm ・Construction: 15 mm robust polypropylene structure ・Liquid management: Frequency-controlled pump, dosing container, digital flow control ・Cover: Double glass lid (visibility & maintenance access) ・Rinse: Advanced cascade rinsing technology ・Environment: Wastewater-reducing circuits, low emissions & low noise ・Certification: TÜV SÜD WHG certified ・Compatibility: Suitable for thin and thick substrates ・All parameters customizable to substrate specifications
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Applications/Examples of results
・RoHS-compliant lead-free surface finish for automotive electronics ・Surface treatment for telecom and 5G infrastructure PCBs ・Quality stabilization for medical device PCBs ・Compatible with thin flexible substrates Positioned as the final wet process step after stripping and before depaneling. Combines with TSK's full wet chemistry line (Desmear, PTH, DES/SES) for a complete one-stop PCB wet process.
Company information
WorldLink Co., Ltd. Founded in 2022, WorldLink Co., Ltd. is a professional industrial agency based in Osaka, Japan. Founder Mr. Peter has 23 years of professional experience in the semiconductor, solar energy, lithium battery and automation industries. The company has signed official agency cooperation agreements with German enterprises TSK, Photonics-Systems-Group, Ekvip Automation and Chinese enterprise Beijing Nanotop electronic Technology. WorldLink focusing on providing partners with Japanese market development, business connection and localized operation services.
