Perfect smear removal for high-aspect-ratio vias. Optimized for ultra-thin substrates with advanced horizontal transport technology.
The Höllmüller DESMEAR by TSK Schill is a premier horizontal wet chemical system designed for the critical Desmear and Surface Conditioning process in PCB and HDI manufacturing. It is specifically engineered to remove resin residues (smear) generated during laser drilling, ensuring 100% reliability for subsequent plating steps. The system’s advanced fluid dynamics provide intensive chemical exchange even within small, high-aspect-ratio blind vias and through-holes. This uniform treatment ensures superior adhesion for electroless copper, which is vital for high-reliability automotive and server boards. Furthermore, TSK’s specialized horizontal conveyor system is world-renowned for its ability to transport ultra-thin and flexible substrates without damage or tension. Built with a robust 15mm thick polypropylene (PP) structure, the system delivers 24/7 industrial durability in the most aggressive chemical environments.
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basic information
[Process Performance] Application: Chemical desmear (permanganate process) and surface swelling/conditioning. Via Cleaning: High-impact fluid exchange for consistent smear removal in micro-vias. Substrate Range: Expertly handles everything from standard rigid boards to ultra-thin and flexible materials. [Engineering Excellence] Structure: Heavy-duty 15mm reinforced Polypropylene (PP) housing for maximum chemical and heat resistance. Advanced Rinsing: Multi-stage, high-efficiency rinsing modules to prevent chemistry carry-over and ensure process purity. Control System: Advanced Industrial PLC Control (Siemens S7-1500 etc.) for precise temperature and concentration management. [Maintenance & Serviceability] Accessibility: Large, integrated glass covers for easy visual monitoring; drive systems positioned for rapid front-side access. Filtration: Integrated high-capacity filtration systems to maintain bath longevity and reduce downtime.
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Applications/Examples of results
[Core Applications] Next-Gen HDI & IC Substrates: Essential for ensuring yield in fine-pitch, high-density interconnects. Automotive Electronics: Guaranteed plating adhesion for safety-critical ECU and sensor boards. Flexible & Rigid-Flex: The industry standard for processing delicate, thin-core materials. [Why Höllmüller DESMEAR?] TSK Schill (incorporating the legacy of Höllmüller) provides the most stable horizontal desmear platform in the industry. Our systems are chosen by global Tier-1 manufacturers because they deliver zero-residue results on a massive scale. By combining German engineering with a focus on uptime and chemistry efficiency, we help you achieve the highest possible reliability in your via-connection processes.
Company information
WorldLink Co., Ltd. Founded in 2022, WorldLink Co., Ltd. is a professional industrial agency based in Osaka, Japan. Founder Mr. Peter has 23 years of professional experience in the semiconductor, solar energy, lithium battery and automation industries. The company has signed official agency cooperation agreements with German enterprises TSK, Photonics-Systems-Group, Ekvip Automation and Chinese enterprise Beijing Nanotop electronic Technology. WorldLink focusing on providing partners with Japanese market development, business connection and localized operation services.
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