Laser Depaneling System | Stress-free & Dust-free Singulation
Photonics Systems Group / DP1020
±20μm precision. Zero mechanical stress prevents cracks in automotive/medical PCBA. Significant yield improvement over routing.
The depaneling by Photonics Systems Group (PSG) is a high-end laser singulation solution designed for mission-critical electronics in automotive, medical, and industrial sectors. Unlike traditional routing or dicing, our non-contact laser process eliminates mechanical stress, preventing micro-cracks in sensitive components like ceramic capacitors and avoiding short-circuit risks from glass fibers or debris. With a cutting accuracy of ±20μm, it allows for ultra-narrow kerf widths, significantly increasing panel yield by over 20% in various use cases—leading directly to material cost optimization. Furthermore, the system ensures high technical cleanliness (compliant with international standards such as ISO 16232). By minimizing particle generation, it reduces the burden of post-process cleaning and enhances the long-term reliability of high-density boards. Engineered with German precision and powered by Beckhoff TwinCAT 3 for seamless automation, the depaneling.S ensures stable 24/7 operation. It is the new standard for improving both manufacturing yield and quality assurance.
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basic information
[Processing Performance] Cutting Accuracy: ±20 µm or less (High-precision galvo scanner control) Edge Quality: Clean, flat edges with minimal burrs or exposed glass fibers. Low Thermal Impact: Minimized Heat Affected Zone (HAZ) protects nearby components. [System Configuration] Laser Source: Optimized high-power Green Nanosecond Laser. Optics: High-speed scanning head with F-Theta lens. Vision System: High-resolution camera for automated fiducial alignment. [Capabilities] Max Panel Size: 460 mm x 500 mm. Supported Materials: FR4, Multilayer PCB, Flexible PCB (FPC), Polyimide. Scalability: Optional dual-head configuration to halve cycle times. [Operation & Safety] Control Platform: Beckhoff TwinCAT 3 (Industry 4.0 ready). Safety Standard: Class 1 Laser Product (Enclosed housing for operator safety). Software: Supports DXF, Gerber, and various CAM data imports.
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Applications/Examples of results
[Target Industries] Automotive: ECU, ADAS sensors, EV power units. Medical: Hearing aids, implantable devices, precision bio-sensors. High-Density Electronics: Mobile devices, wearables, IoT terminals. Aerospace & Defense: Boards requiring extreme reliability and cleanliness. [Key Applications] Precision cutting (tab-cut/full-cut) of FR4, CEM, and Polyimide (PI). Accurate cutting of coverlays and stiffeners. Traceability marking (DMC/text) available as an option. [Proven Reliability] With over 2,900 units installed worldwide by the Photonics Systems Group, our technology is trusted by leading global Tier-1 suppliers and EMS providers. Most of these systems operate as core equipment in highly automated production lines. The superior cleanliness and accuracy, which meet rigorous German automotive standards, are highly valued by top global manufacturers for simultaneously achieving higher yields and stricter quality control.
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Company information
Worldlink LLC Founded in 2022, Worldlink LLC is a professional industrial agency based in Osaka, Japan. Founder Mr. Peter has 23 years of professional experience in the semiconductor, solar energy, lithium battery and automation industries. The company has signed official agency cooperation agreements with German enterprises TSK, Photonics-Systems-Group, Ekvip Automation and Chinese enterprise Beijing Nanotop electronic Technology. WorldLink focusing on providing partners with Japanese market development, business connection and localized operation services.
