Vacuum heat press device. High-precision press, short operation time, compatible with thermal curing and UV curing!
The press mold is equipped with a vacuum chamber, allowing for quick vacuum reduction to remove air bubbles (micro voids) and achieve uniform vacuum bonding. Mikado's quick vacuum heat press series offers extensive customization options. ● Vacuum Star ... 200℃ vacuum heat press device ● Vacuum Ace ... Balancer-type vacuum heat press device ● Vacuum Neo ... 400℃ vacuum heat press device Mikado's quick vacuum system, capable of high-precision pressurization and short working times, is also suitable for thermal curing and UV curing, making it effective in many fields. 【Features】 ■ High-precision pressurization system ■ High-precision temperature system ■ Maintenance-free ■ Vacuum chamber ■ Slide table ■ Pressurization cylinder This is a vacuum heat press device that accommodates a wide variety of configurations. ◆◇ For more details, please request documentation or download the catalog ◇◆
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A vacuum chamber is attached inside the press mold, allowing for quick vacuum reduction to remove air bubbles (micro voids) and achieve uniform vacuum bonding. Mikado's quick vacuum heat press series offers extensive customization options. ● Vacuum Star ... 200℃ vacuum heat press device ● Vacuum Ace ... Balancer-type vacuum heat press device ● Vacuum Neo ... 400℃ vacuum heat press device Mikado's quick vacuum system, capable of high-precision pressure application and short working times, is suitable for thermal curing and UV curing, and is utilized in many fields. 【Features】 ■ High-precision pressure system ■ High-precision temperature system ■ Maintenance-free ■ Vacuum chamber ■ Slide table ■ Pressure cylinder This is a vacuum heat press device that supports a wide variety of configurations. ◆◇ For more details, please request materials or download the catalog ◇◆
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EVA's vacuum lamination, multilayer lamination of green sheets, flattening of substrates, bonding of bus bars and reinforcement plates, pattern transfer, film transfer, glass, silicon Si wafers, FPD flat panel displays, package substrates, embossing, bonding to curved surfaces, molding of micro-lens arrays, UV-curing resin encapsulation, and applications in organic EL and MEMS are utilized.
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