Ideal for applications such as prototype BGA packages and reballing! This is a space-saving, tabletop solder ball machine.
No metal mask required, single-shot method solder ball mounting machine. Since balls are mounted one by one, there is no wasteful consumption of balls. Various ball mounting patterns can be easily set on the touch panel, and the process from flux application to solder ball mounting is done automatically. There is no need to create a metal mask for each pattern, which reduces running costs and makes management easier, allowing for quick responses to needs such as prototyping BGA packages, automating BGA reballing, and partial ball mounting.
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basic information
- Single-shot method for loading one ball at a time - Compatible with solder balls with a diameter of φ0.2mm or larger - Built-in precision flux dispenser - Stabilization of flux application amount through temperature control - Easy operation and various settings on a color touch panel - Single-shot capability to specified ball pads - Compact tabletop design - Automatic detection of the board surface - Ball loading based on BGA coordinate data (optional) - Position correction and ball presence inspection using image processing (optional)
Price range
P6
Delivery Time
※Please contact us.
Applications/Examples of results
Mounting solder balls on BGA packages and circuit boards, as well as reballing.
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Company information
Our company was founded in 1976 in Okaya City, Nagano Prefecture, and since then, we have expanded our export business of machine tools to the Chinese and Southeast Asian markets. Starting in 1997, we began importing, selling, and servicing equipment for the electronics industry. Currently, we are also working on the development of our own products, such as various reflow soldering machines and ultrasonic metal joining devices, to meet market needs.