Automatic alignment of chips equipped with image processing, compatible with COG/COF.
The image processing system recognizes the alignment marks and automatically aligns the chips. It is a simple yet highly precise tabletop machine.
Inquire About This Product
basic information
This is a device for aligning and mounting an IC chip at one location on an LCD/FPC. It recognizes the alignment marks of the workpiece using an image processing system and performs automatic alignment. After that, fine adjustments are made by the operator, and the IC chip is mounted. [Specifications excerpt] LCD/FPC size: Max. 210 x 180mm (supports up to 12 inches as an option) IC chip size: Min. 4 x 0.7mm Max. 50 x 2.5mm
Price range
Delivery Time
Applications/Examples of results
Corresponding to the next process: COG/COF
catalog（1）
Download All Catalogs
Company information
Since our founding, we have been comprehensively developing the design, manufacturing, and sales of microelectronics assembly equipment using precision sheet metal processing and ACF bonding technology. Since we began to commercialize the know-how cultivated in sheet metal processing as a tool for improving quality and productivity, we have consistently pursued business diversification and management independence through differentiated technologies. In the field of sheet metal processing, we are capable of vertical integration from product design and development to the assembly of finished products, not just contract processing, providing OEM and ODM (Original Design Manufacturing) products to our client companies. In the area of ACF bonding assembly machines, supported by the rapid development of the FPD industry, our products are adopted by many customers both domestically and internationally. In 1999, our tabletop COG assembly machine, which overturned industry norms, received the annual excellence award from the Nikkei newspaper. We take pride in the fact that the emergence of this tabletop machine has broadened the industry from being the domain of a few large companies to include many small and medium-sized enterprises. We have successfully developed the world's first "full-auto FOB line," and along with our manual tabletop machines and standalone semi-auto machines, we have evolved into a full-line manufacturer of ACF bonding assembly machines.
![[Test Reception Open] Automatic Solder Ball Mounting Line](https://image.mono.ipros.com/public/product/image/394/2001489711/IPROS58276800525874369337.png?w=280&h=280)
