Large substrate compatible rework device SUMMIT. It minimizes substrate warping with advanced temperature control.
A high-performance SMD/BGA rework station that minimizes thermal stress on the implemented components and achieves a highly reproducible heating profile. It demonstrates its true value particularly in the rework of large substrates, high thermal dissipation substrates that are difficult to heat, and high-value-added assembly substrates.
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basic information
■SUMMIT Rework System Lineup ●SUMMIT II Equipped with advanced auto-profile function, a benchmark for BGA rework equipment ●SUMMIT 1800 High-performance model packed with advanced features such as digital flow control and electric top heater ●SUMMIT LX Top-end model of SUMMIT compatible with large substrates up to Max. 610×915mm
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Applications/Examples of results
Removal, mounting, and reflow soldering of components such as BGA, CSP, and connectors on large substrates.
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Company information
Our company was founded in 1976 in Okaya City, Nagano Prefecture, and since then, we have expanded our export business of machine tools to the Chinese and Southeast Asian markets. Starting in 1997, we began importing, selling, and servicing equipment for the electronics industry. Currently, we are also working on the development of our own products, such as various reflow soldering machines and ultrasonic metal joining devices, to meet market needs.