This is the process being carried out at our company.
As part of the processing steps for electronic devices utilizing ICs that our company conducts, we follow the procedures below: ○ Die bonding ←→ Adhesion of IC to substrate ○ Wire bonding ←→ Connection between substrate and IC using gold wire ○ Wire inspection ←→ Inspection of bonding errors and loop shape ○ Encapsulation potting ←→ Protection of IC and gold wire ○ Electrical characteristic inspection ←→ After soldering or after assembly ○ Soldering ←→ Soldering by reflow, dipping, or hand soldering ○ Thermal compression bonding ←→ Heat sealing, connection of flex ○ Assembly ←→ Various types of assembly ○ Packaging In each step of the process, we always tailor the selection of materials, plating thickness, types of equipment, and appearance standards to meet our customers' needs.
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basic information
【Features】 ○ Processing steps tailored to the situation ○ Sealing potting ←→ Protection of IC and gold wire ○ Wire bonding ←→ Connection between substrate and IC using gold wire ● For other functions and details, please contact us.
Price information
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Delivery Time
Applications/Examples of results
【Usage】 ○ Processing of substrates and IC chips ● For other functions and details, please contact us.
Company information
Our company is walking together with Mitutoyo, a measuring instrument company that spreads its wings globally, and Seiko, a partner in electronic components and watches.
