From one piece to mass production, we respond with short lead times! Feel free to leave special modifications (jumpers) to us!
At AIM, we handle various rework related to BGA, including the installation and removal of BGA/CSP, as well as the reballing of removed BGAs. We undertake 500 items of BGA rework and 200 items of reballing annually. Over 20 years of handling various products and circuit boards has allowed our technical department to accumulate a vast amount of know-how. We can respond to both rework and reballing requests from one piece to mass production with a short lead time. 【Features】 ■ Abundant track record and experience ■ Removal of BGA underfill ■ Standard rework masks and various solder balls in stock ■ ISO 9001 certified and obtained in 1998 ■ Installation of interposers and rework of PoP devices are also possible *For more details, please refer to the PDF document or feel free to contact us.
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basic information
Reliability Testing <Main Measurements and Tests> ■ Bump Height Measurement ■ Substrate Warpage Measurement ■ Ball Shear Test ■ Ball Pull Test ■ Cross-Section Observation ■ Temperature Cycle Test *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Examples of Use】 ■ Design, Development, Quality Control Departments ■ Manufacturing, Repair Departments *For more details, please refer to the PDF document or feel free to contact us.
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Company information
AIM is a manufacturer of printed circuit board assembly for semiconductors and electronic components, providing services from prototype assembly to mass production assembly for various electronic devices. We also handle many requests for assembly evaluation, modification and repair of assembled printed circuit boards, and BGA rework, particularly excelling in BGA rework, reballing, and jumpers with over 20 years of experience. We receive hundreds of rework requests annually from customers in various industries and have earned a high reputation. In recent years, due to the semiconductor shortage, we have received numerous inquiries and requests from customers wanting to remove and regenerate semiconductors from circuit boards. We have extensive experience and a proven track record in the removal and reballing of BGA and QFN (patent pending), so customers considering regeneration and reuse are encouraged to consult with us. We will provide proposals to solve various challenges related to your circuit board assembly. For any inquiries regarding printed circuit board assembly, rework, or inspection, please feel free to contact AIM.
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