It is a sheet-type spin etcher compatible with 300mm wafers and double-sided processing!
The "ME-5000" is a single-wafer spin etcher compatible with 300mm/8.6.4 inch silicon wafers, as well as 8.6.4 inch SiC and GaN wafers, featuring a mechanical grip. The etching chamber has a movable upper and lower mechanism, allowing for rotation and vertical movement with two arms. An airflow is created inside the cleaning cover, and the chemicals are separated and recovered using five types: four types of acid-based solutions and pure water. For more details, please contact us or download the catalog.
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basic information
【Features】 ○ Compatible with 300mm/8.6.4 inch silicon wafers, as well as 8.6.4 inch SiC and GaN wafers ○ Mechanic grip for double-sided processing (patented) ○ Vertical movement system for the etching chamber ○ Movement by two arms allows for rotation and vertical motion ○ Creates airflow within the cleaning cover (clean shower method) ○ Chemicals can be separated and recovered in five types: four types of acid-based and pure water ○ Mixed acid (hydrofluoric-nitric) can also be used ○ Supported rotation speed: MAX 5000rpm with three position settings ○ Main body size: W485×D625×H1270 ● For more details, please contact us or download the catalog.
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Applications/Examples of results
Cleaning after surface polishing of the wafer.
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Company information
July 2009: Received certification for a research and development plan related to the advancement of manufacturing infrastructure technology for small and medium-sized enterprises from the Ministry of Economy, Trade and Industry. June 2010: Began joint development with the National Institute of Advanced Industrial Science and Technology on glass etching for solar cells. February 2011: Ordered and received an 8-inch chemical cleaning system for the 3D semiconductor research center. July 2011: Contracted by Saitama Prefecture for the next-generation industry entry support project. November 2011: Developed an alkaline spin etching system. Specifications: For large substrates (300 mm square). February 2012: Completion of the next-generation industry entry support project in Saitama Prefecture. April 2012: Newly developed silicon wafer separator for solar cells.