List of Electronic Components products
- classification:Electronic Components
8371~8415 item / All 26360 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
For more realistic and larger-scale visual productions, further enhancement of the projector's capabilities is needed!
- filter
High-performance optical sensors compatible with advanced space observation! Achieved high reflectivity characteristics!
- Sensors
Add color variations to IR sensor windows to match the space design! Here are examples of achieving a luxurious restroom space!
- Sensors
Affordable and high-efficiency AC adapters, GaN-equipped (gallium nitride) fast chargers, battery chargers, and power products manufactured in Southeast Asia, including cables.
- AC adapter
- Switching Power Supply
- Charger
Lightweight, low heat absorption, and low thermal conductivity! High heat resistance and excellent chemical resistance. Suitable as transport pallets or jigs for various substrates.
- Printed Circuit Board
- Processing Jig
- Other cutting tools
Various design and manufacturing operations! We will propose suitable processes and methods!
- Circuit board design and manufacturing
- Printed Circuit Board
- Mechanical Design
Transparent flexible printed circuit boards contribute to improved design with excellent transparency! The fine patterns make the wiring inconspicuous.
- Other electronic parts
[Press Release from Taiyo TechnoRex] Regarding the Improvement of High-Density Wiring Formation Technology Using the Patterned Beer Fill Method
Our company has further improved the technology for forming high-density wiring in our core business of electronic substrates, specifically in flexible printed circuit boards (FPCs). In recent years, electronic devices such as medical equipment and industrial machinery have been advancing in miniaturization and lightweight design. To incorporate many functions into limited space, there is a demand for increased wiring density on the substrate. Therefore, we have been working on establishing filled via technology and improving the M-SAP method. The filled via structure involves filling vias (holes) made by laser in the insulating layer with copper plating, ensuring electrical connections on both sides of the substrate while reducing the recesses of the vias, which allows for component mounting on the vias and leads to high-density mounting. On the other hand, the M-SAP method significantly improves line width management by laminating copper to form circuits, enabling high-density wiring. This time, based on the pattern via fill method that leverages these characteristics, we successfully formed wiring with a pitch of 30μm on a double-sided substrate with a filled via structure. We will continue to aim for further improvements in high-density wiring formation technology through ongoing development, prototyping, and verification.
Waterproof and dustproof with a resin housing! Optional specification with coil economizer available.
- Other electronic parts
Achieve higher measurement accuracy in a wide range of applications! Supports an extended temperature range.
- Amplifier
Support for RGMII! Introduction of Ethernet physical layer transceivers.
- Other electronic parts
Ideal for wireless device applications! Reduces unnecessary radiation.
- filter
IP67 design! Designed for UPS, EV chargers, and e-mobility, etc.
- Other electronic parts
We will provide you with the latest information on "Majesty-DI."
- Printed Circuit Board
- Photomask
- Substrate transport device (loader/unloader)
DI equipment suitable for substrate manufacturing lines! Ideal for precision-focused substrate manufacturing with automatic alignment functionality.
- Circuit board design and manufacturing
- Printed Circuit Board
Latest information on the direct imager "Majesty-DI"
We would like to share the latest information about the direct imager "Majesty-DI." ● A high-output type will be added to the "Majesty-DI" lineup. Its main applications include solder resist exposure and models compatible with low-sensitivity photosensitive resins. It can be widely used for solder resist exposure of printed circuit boards as well as in metal processing. ● Automation support To reduce manpower in the printed circuit board exposure process, we have implemented automation from input to output. It is also compatible with roll materials. ● Alternative operation to photoplotters By using UV film, it is possible to create exposure films in a yellow room. The Majesty-DI can be used as an alternative to photoplotters. ● Improved front-back alignment accuracy The alignment function utilizing the color development of DFR with UV marks on the exposure table eliminates the need for reference holes. It achieves a front-back alignment accuracy of 15μ (specification: actual value below 10μ). *For more details, please refer to the PDF document or feel free to contact us.
Compatible with models such as FCB digital cameras (LVDS compatible) LVDS/USB3.0 camera tail board.
- Other electronic parts
We handle various types of AC adapters.
- power supply
- Switching Power Supply
REM60-W series 60W DC/DC converter with medical certification
- power supply