List of CAE products
- classification：CAE
931～945 item / All 3945 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
Experiments and measurements on actual devices can be conducted as needed! We provide certification support tailored to each industry and region.
- simulator
We will adjust the model parameters to achieve a sufficient fit with the actual measurements!
- simulator
Adjusting the input waveform for the simulation! Achieving accurate tabletop vibration analysis that reproduces off-road driving conditions.
- simulator
We propose an "advanced fatigue analysis process" that takes into account manufacturing influences and manufacturing factors!
- Other analyses
We propose a fatigue analysis process for structures considering the behavior of fluids and gases!
- Other analyses
GNSS constellation, RF threats, and a simulator that generates other navigation signals!
- simulator
30 years of supported computational power - High-speed circuit simulator for power electronics, Scideam.
- simulator
【Exhibition Information】Exhibiting at Automotive World 2026! We will introduce products that utilize AI for model-based development, including in-car display reproduction, and cover everything from motor design for car electronics to practical operation simulations.
We will be showcasing solutions for automotive electronics. In addition to model-based development (MBD), simulation, and measurement/testing environments based on the power electronics solutions we have cultivated over many years, we will introduce innovative items essential for next-generation automotive electronics. This time, we have prepared a "3D motion capture" experience for you. Please be sure to try it out.
It is also possible to display various maps of each phase! Analysis is based on the information of the crystal structure possessed by the sample.
- Contract Analysis
Example of analysis of compounds at the SAC solder and Ni pad interface.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.
Appearance inspection, electrical inspection, and internal observation using X-rays conducted! Introduction of analysis cases.
- Contract Analysis
Analysis case of faulty switch contacts
Since a malfunction was suspected in the switch section of the appliance that would not power on, we will introduce a case study along with the work flow. First, we check for any shape changes such as swelling, cracking, or discoloration through visual observation. In the electrical check, we confirm whether the malfunction can be reproduced and whether it is an open or short circuit. An internal observation using X-rays revealed that the contact terminals inside the switch had melted, scattered, and disappeared, resulting in an open failure. Ultimately, we will submit a report that includes the consideration of the cause. We also accept inquiries for analysis consultations after non-destructive testing, so please feel free to contact us.
Observation of the sensor chip surface, creating a cross-section through mechanical polishing in the mounted state, and conducting structural observation of the device!
- Analysis Services
- Analytical Equipment and Devices
Confirmation of chiplet package structure by mechanical polishing.
Regarding the chip mounted on the main circuit board of the VR goggles manufactured by Company A, upon visual observation, it was inferred that it has a chiplet structure with multiple chips integrated. To examine the structure in more detail, we created a cross-section using X-ray CT observation and mechanical polishing, and we will introduce the structural confirmation results. *For more details, please download the PDF or feel free to contact us.*
Measure the change state with a 3D shape measuring device! Visually confirm the indented shape and amount due to pressure.
- Analysis Services
- Analytical Equipment and Devices
Observation of thermal deformation using a 3D shape measuring machine (VR-6200)
This is a measuring device that can non-contact measure surface shapes such as concavities, undulations, and surface roughness. We will introduce "heating deformation observation" using a 3D shape measuring machine. First, we acquire a 3D texture image at room temperature, and then we acquire a 3D texture image in the heated state. By overlaying the texture images before and after heating and checking the differential texture image and cross-sectional profile, it can be seen that the substrate in the heated state has higher ends and a lower center compared to the room temperature state.
By adding a special reagent to the sample and heating it, it becomes possible to detect substances that are usually difficult to detect!
- Analysis Services
- Contract Analysis
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.
We will suggest appropriate analysis methods based on the condition of polymer materials and samples!
- Contract Analysis
- Analysis Services
- Contract Analysis
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.