List of Semiconductors and ICs products

  • classification:Semiconductors and ICs

2131~2160 item / All 4513 items

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For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.

  • TRON 1000.PNG
  • TRON 5000 black n white.JPG
  • TRON 5000.JPG
  • CSM.JPG
  • Butyl Smooth.JPG
  • Work gloves

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Notice of participation in 'INTERPHEX Week Tokyo' from May 20 (Wednesday) to May 22 (Friday), 2026.

Ito Corporation will be exhibiting at "INTERPHEX Week Tokyo" held at Makuhari Messe. This exhibition is the largest in Japan, showcasing a wide range of products and services related to the research and manufacturing of pharmaceuticals, cosmetics, and regenerative medicine from 25 countries and regions around the world. Pharmaceutical and cosmetic manufacturers, as well as regenerative medicine companies, will be attending from all over the globe. We will be showcasing "Gloves for Glove Boxes/Isolators" manufactured by Tron Power. We look forward to your visit.

W42 x H25 x L25.4 mm Heat sink for PCB mounting with solder pin (transistor screw mounting)

  • sk129_sts.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Utilized in many products around us! An introduction to the manufacturing processes and applications of semiconductors.

  • Wafer

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Introduced in the PCB design guidelines of Germany's largest semiconductor manufacturer.

  • ICKSMDF17.JPG
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Selectable board materials, core material types, and side plating types! Excellent electromagnetic wave shielding effect.

  • Other electronic parts
  • Other semiconductors

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Clip-on heat sink for TO-218 package

  • fk224_218_1.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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[Problem-Solving Material Release] Freely design the opening mesh of the printed part! Prevent mask deformation due to printing load and suppress changes in transfer dimensions!

  • Other semiconductors

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Processing products that require strict precision with a single chuck! Cultivating technology that can sufficiently handle mass production.

  • Processing Contract
  • Other optical parts
  • Other semiconductors

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Teflon socket for TO-5 package 3 pins

  • tf-53-to-5パッケージ-トランジスタ用テフロンソケット-fischer-elektronik (1).jpg
  • IPROS2175634052087143217.jpeg
  • Other semiconductors

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We will be exhibiting at 'SEMICON JAPAN' held at Tokyo Big Sight (East Exhibition Hall) from December 13 (Wednesday) to 15 (Friday), 2023!

  • Wafer

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We offer affordable alternatives for hard-to-obtain electronic components and parts that have increased in price!

  • Other semiconductors

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Extruded heat sink with hole processing for TO-3, TO-66, SOT-9, and SOT-32 packages.

  • sk01.eps (1).jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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The LAM7 series in W70mm x H70mm is finally here.

  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • lam7.eps.jpg
  • Home - Fischerelektronik - LAM 7_01.jpg
  • Home - Fischerelektronik - LAM 7_02.jpg
  • Other semiconductors

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It can fix a TO-247 package semiconductor without screw holes to a heat sink.

  • thfk247.eps.jpg
  • IPROS2175634052087143217.jpeg
  • Other semiconductors

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Introduced with a variety of diverse options! Non-touch frames and semi-self-checkout systems, etc.

  • Dedicated IC
  • Entrance and exit control system

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We have two in-house quality assurance centers, and we have completed ISO 9001 international standard certification!

  • Other semiconductors
  • Other electronic parts
  • Interior parts

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SMT clips for 0.65mm blade fuses (reel product)

  • sik25smd_tr.jpg
  • sik25smd.eps.jpg
  • IPROS2175634052087143217.jpeg
  • Other semiconductors

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It is a clip that can secure TO-247 and TO-264 package transistors to a heat sink without screws.

  • thfm20.eps.jpg
  • IPROS2175634052087143217.jpeg
  • Other semiconductors

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Thermal elements of fine ceramic semiconductors! Explaining physical properties.

  • Other semiconductors

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Are you struggling with implementing AI in your environment? We solve the challenges of AI implementation in harsh conditions for devices with AI chips suitable for industrial applications.

  • Dedicated IC
  • Embedded Board Computers
  • Expansion Boards

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We have released a white paper on approaches to implementing image AI and edge AI in harsh environments.

Recently, various AI applications have reached a practical level. Their uses are diverse, and there are expectations for their application in various locations. However, implementing them at the edge requires addressing the heat dissipation of high-heat-generating components while ensuring coordination with machine control and maintaining strict environmental durability through temperature management, vibration control, and mechanical design. Analog Tech has compiled an approach for implementing image AI and edge AI in field environments, along with platform information for implementation, in a white paper. Please refer to it. You can find more information in the following catalog download from Ipros: https://premium.ipros.jp/analogtech/catalog/detail/619854/

◆915nm, 976nm ◆Low NA design ◆High fiber coupling efficiency ◆1040–1200nm return light protection

  • Other optical parts
  • Other physicochemical equipment
  • Other semiconductors

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Optimal for efficient heat dissipation of transistors during substrate mounting.

  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Optimal for efficient heat dissipation of transistors during substrate mounting.

  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Efficient heat dissipation achieved with a hollow-type heat sink and axial fan.

  • la6.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Efficient heat dissipation achieved with a hollow-type heat sink and axial fan.

  • la7.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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A heat sink that can be directly attached to a transistor without screws.

  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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You can fix the transistor to the heat sink with a spring.

  • thfm.eps.jpg
  • IPROS2175634052087143217.jpeg
  • Other semiconductors

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Efficient heat dissipation achieved with a hollow-type heat sink and axial fan.

  • la21.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Optimal for efficient heat dissipation of transistors during substrate mounting.

  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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A heat sink that can be mounted without screws on TO-220 package semiconductors.

  • fk220sa220.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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