List of Other semiconductors products

  • classification:Other semiconductors

751~780 item / All 2535 items

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For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.

  • TRON 1000.PNG
  • TRON 5000 black n white.JPG
  • TRON 5000.JPG
  • CSM.JPG
  • Butyl Smooth.JPG
  • Work gloves

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Notice of participation in 'INTERPHEX Week Tokyo' from May 20 (Wednesday) to May 22 (Friday), 2026.

Ito Corporation will be exhibiting at "INTERPHEX Week Tokyo" held at Makuhari Messe. This exhibition is the largest in Japan, showcasing a wide range of products and services related to the research and manufacturing of pharmaceuticals, cosmetics, and regenerative medicine from 25 countries and regions around the world. Pharmaceutical and cosmetic manufacturers, as well as regenerative medicine companies, will be attending from all over the globe. We will be showcasing "Gloves for Glove Boxes/Isolators" manufactured by Tron Power. We look forward to your visit.

Transistor spacer for TO-5 package 3 pins (height 2.5mm)

  • ms-53-25-to-5パッケージ用トランジスタスペーサー.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Thermal pad for TO-5 package transistors

  • aos-5-アルミナセラミックサーマルパッド-al2o3 (1).jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Thermal pad for TO-247 and TO-218 package transistors.

  • aos218_247.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Fischer Elektronik manufactured high-performance heat sink for forced air cooling (hollow type) W200mm x H84mm

  • SK440.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Clip-type heatsink for TO-220 package semiconductors that can be mounted without screws.

  • fk255.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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54mm diameter round LED heat sink

  • ICKLEDR54x20G.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Clip-type heat sink that can be mounted without screws on TO-247, TO-248, TO-220, and TO-218 package semiconductors.

  • FK-245-MI-247-O.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Insulated clamp parts for TO-247 package power transistors

  • 1708478417.jpg
  • 1708478431.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Round Pin Heat Sink "ICK S R 140 x 70"

  • ick_s_r140x70.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Efficient heat dissipation is possible with a W129mm x H66mm hollow-type heat sink and axial fan.

  • la_hb5.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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A clip that can securely make contact with a TO-220 package transistor and a heat sink.

  • thfa2.jpg
  • thfa2.eps.jpg
  • IPROS2175634052087143217.jpeg
  • Other semiconductors

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98 mm diameter x 50 mm height round pin fin heat sink (Al99.5)

  • 1737000620.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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This is a black anodized heat sink for BGA with a width of 45 mm, a length of 42.5 mm, and a height of 6 mm.

  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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200mm diameter, 40mm height round LED heat sink

  • 1737001963.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Efficient heat dissipation is possible with a W66mm x H66mm hollow-type heat sink and an axial fan.

  • la_hb4.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Axial flow heat sink with axial flow fan for AC230V

  • la_hl3.eps.jpg
  • la_hl1_3diag.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Heat sink for DIP IC (14, 16 contacts)

  • ick1416l.jpg
  • ick_l.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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High-performance heat sink for forced air cooling (hollow type) W400mm x H88mm, 31 fins

  • sk440_461.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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With a pressing force of 55N, the transistor in the TO-220 and TO-3P packages can be reliably brought into contact with the heat sink.

  • thfa8.eps.jpg
  • IPROS2175634052087143217.jpeg
  • Other semiconductors

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With a pressing force of 59N, it is possible to ensure that transistors in TO-248 and TO-218 packages make reliable contact with the heat sink.

  • thfa4.jpg
  • thfa4.eps.jpg
  • IPROS2175634052087143217.jpeg
  • Other semiconductors

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A pressing force of 20N can reliably ensure that the TO-220 package transistor makes contact with the heat sink.

  • thfa1.jpg
  • thfa1.eps.jpg
  • IPROS2175634052087143217.jpeg
  • Other semiconductors

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One-stop solution from design to manufacturing of power semiconductors!

  • Other semiconductors

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Nikkankogyo Shimbun - Award-winning products of the Excellent New Technology and New Products Award! Eliminated the need for external shielding.

  • Other semiconductors

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You can download and view the latest flyers and catalog data distributed at the exhibition held in November 2024!

  • DRAM&Flash.JPG
  • カメラモジュール.jpg
  • Memory
  • Other semiconductors

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We offer semiconductor products primarily featuring Toshiba semiconductors, as well as LCDs and electronic components!

  • Other semiconductors

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Achieving a product pitch of ±0.03mm tailored to the specifications of the automatic assembly line! *Samples available upon request.

  • Other semiconductors

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Achieved a product pitch of ±0.03mm tailored to the specifications of the automatic assembly line!

  • 12a.PNG
  • 12b.PNG
  • Other semiconductors

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Achieves low RDS(on) to maximize the effective use of package space.

  • Other semiconductors

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Introducing our unique package and DioMOS technology fusion module!

  • Other semiconductors

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The adoption of a unique gate structure chip achieves high tolerance against lightning surges and other disturbances!

  • 3-2.PNG
  • Other semiconductors

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