Microblast processing
Leave the prototype to mass production of "Microblast" to us.
Our company specializes in micro-blasting processing suitable for brittle materials (such as glass, ceramics, silicon wafers, and carbon) used in semiconductor-related components and electronic parts. Micro-blasting is a technique where a workpiece laminated with UV-curable resin film is exposed and developed through photolithography, followed by the controlled spraying of fine abrasive materials for processing. If you are interested in processing, please feel free to consult us about your desired processing details within the possible range. 【Features】 ■ Original in-house blast nozzle ■ Direct pressure type (pressurized) ■ Cyclone-type abrasive circulation mechanism ■ Screw feeder type abrasive supply mechanism *For more details, please refer to the external link page or feel free to contact us.
- Company：アルプスエンジニアリング
- Price：Other
