We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Board mounting.
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Board mounting Product List and Ranking from 98 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Dec 24, 2025~Jan 20, 2026
This ranking is based on the number of page views on our site.

Board mounting Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Dec 24, 2025~Jan 20, 2026
This ranking is based on the number of page views on our site.

  1. ビオラ Fukushima//Electronic Components and Semiconductors
  2. ケイ・オール Tokyo//Manufacturing and processing contract
  3. フェイス Kanagawa//Industrial Electrical Equipment
  4. 4 デンオン機器 Tokyo//Industrial Electrical Equipment
  5. 5 京写 Kyoto//Consumer Electronics

Board mounting Product ranking

Last Updated: Aggregation Period:Dec 24, 2025~Jan 20, 2026
This ranking is based on the number of page views on our site.

  1. "BGA Rework / BGA Reballing" *Available from just one unit! ビオラ
  2. Reusable adhesive jig "MagiCarrier" 京写
  3. [Exchange/Installation/Removal] High-quality BGA rework ケイ・オール
  4. Rework System "RD-500S III" デンオン機器
  5. 4 Room temperature implementation metal film rubber ball 'MR-BGA' リトルデバイス

Board mounting Product List

91~105 item / All 200 items

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COF implementation service: Supporting film design, procurement, implementation, and reel shipment.

We perform high-precision mass bonding of bare chips to flexible printed circuit boards (FPC). We can provide integrated support from film design and procurement to assembly and reel shipment.

COF implementation allows for bulk bonding even with multiple pins, and connections can be made in a short time. Furthermore, compared to TCP, it is possible to accommodate finer bonding pitches. Additionally, since film bending is possible, flexible placement is achievable. We provide a consistent line setup from dicing to electrical characteristic testing.

  • Other semiconductors

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Substrate assembly business

Substrate assembly business

We offer a wide range of services from circuit design and prototyping to mass production support. This is an introduction to our PCB assembly business from Fine Electronics. ■□■Features■□■ ■Reliable assembly with excellent technology and flexibility We provide a wide range of services from circuit design and prototyping to mass production support. ■Outstanding procurement capabilities We can leverage our procurement strength according to customer requests, becoming a strong partner for our clients. ■Stress-free lead-free conversion We can alleviate the stress associated with component selection and alternatives, which often become a source of concern. For more functions and details, please contact us.

  • Contract manufacturing

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Strong in prototype printed circuit boards!

What we have is "the skill of experienced craftsmen"! With the techniques and creativity of the artisans, we can handle even the most challenging implementations.

At Yamada Workshop, we perform component mounting on printed circuit boards. While we cannot mass-produce printed circuit boards, our hand soldering by skilled artisans is precise and quick, rivaling machines. Additionally, we offer board modification and repair services. Because we handle non-standard implementations through modifications, we can respond to sudden specification changes and detailed requests. 【Features of Board Mounting】 ■ Yamada Workshop's board mounting is done by hand ■ Hand assembly is our specialty for small lots ■ A team of skilled artisan assemblers ■ Strong in industrial boards ■ Experts in modification and rework *For more details, please refer to the external link page or feel free to contact us.

  • Printed Circuit Board
  • Other mounting machines
  • Prototype Services

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Electronic Equipment EMS Business *Manufacturing track record available

Not only circuit boards, but also total support for equipment assembly and wiring! Leave EMS to Tohsan Electronics!

At Osaka Electronic Equipment Co., Ltd., we are engaged in the EMS (Electronics Manufacturing Services) business. We have manufacturing achievements including the mounting of control boards for molding machines, as well as the mounting of boards and unit assembly for industrial IPCs. We procure parts, manufacture boards, and perform assembly based on the specifications and requests of our customers. Additionally, we can handle not only board assembly but also total solutions including equipment assembly and wiring, so please feel free to contact us. 【Scope of Services (Excerpt)】 ■ Board Assembly - Capable of BGA and CSP mounting - Capable of adjacent mounting of 0603 chips ■ Unit Assembly - Precision equipment assembly - Control panel wiring ■ Wire Processing - Possession of a wide variety of crimping tools *For more details, please refer to the PDF document or feel free to contact us.

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Circuit board assembly

We will mount components on ceramic substrates and glass epoxy substrates to manufacture circuit boards.

Features ■ The mounting components can be handled by SMT (reflow), discrete (flow), or soldering. ■ Both lead-free and leaded solder can be manufactured. ■ Additionally, please consult us about resin coating or molding processing for the mounted circuit boards.

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Dai Kin Electronics Industry Co., Ltd. Circuit Board Assembly

We will achieve a thorough quality assurance system by utilizing advanced manufacturing technology and state-of-the-art equipment.

Based on the experience and implementation technology cultivated over many years, as well as state-of-the-art equipment, we have achieved high quality, short delivery times, and low prices. We can accommodate everything from parts procurement to small-batch production of various types and mass production. We can handle any size or shape of circuit boards, whether single-sided or double-sided.

  • Circuit board design and manufacturing

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M.I.A. Printed Circuit Board Wiring Design and Assembly Services

We have established a system that allows us to consistently handle everything from printed circuit board wiring design to component procurement.

We have established a system that allows us to consistently handle everything from printed circuit board wiring design to component procurement. In our customers' projects, we will take full responsibility for the implementation aspects, managing the traditionally separate tasks of board creation and component procurement. This enables us to provide our customers with reliable solutions that meet their envisioned design goals.

  • Other core systems

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BGA, CSP implementation, rework

Stable quality through process management

With over 15 years of experience, we handle printing inspection, full ball inspection, and X-ray inspection. Additionally, we replace components using rework machines without causing any damage. For more details, please contact us or download the catalog.

  • Technical and Reference Books

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High-density substrate mounting

Supports mass production of 0603 chips and prototype 0402 chips.

We have a proven track record in mass production of high-density chip mounting, focusing on people's livelihoods, and we possess the know-how to mount 0603 chips with high quality in mass production. At the prototype level, we have experience with 0402 chips. For more details, please contact us or download the catalog.

  • Printed Circuit Board

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Substrate modification

We will accommodate pattern cutting and JP wiring, among other things.

At Reship Electronics, we have the technology for pattern cuts and jumper wiring due to specification changes, and we respond to our customers' needs. For more details, please contact us or download the catalog.

  • Printed Circuit Board

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Debugging Software-Defined Vehicles - The Path to "SDV Ready"

Cars are evolving into "running PCs" - A development revolution in the era of SDV.

In the development of Software-Defined Vehicles (SDVs), addressing the complexities of multi-core SoCs and virtualization environments is essential. This white paper provides a detailed explanation of the challenges associated with the transition from traditional E/E architecture to SDVs, as well as the "SDV Ready" debugging and tracing solutions offered by Lauterbach's TRACE32. We will showcase the capabilities of innovative tools that support the entire development lifecycle, from virtual ECUs to actual chips. This is a must-read for all engineers involved in SDV development.

  • Development support tools (ICE, emulators, debuggers, etc.)
  • Other embedded systems (software and hardware)

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Semiconductor assembly and packaging implementation

We perform assembly and packaging of semiconductors (communication systems/MEMS, etc.). We also offer rework services. There is a vacuum reflow available.

In the 3rd Business Division (formerly the Electronic Device Division), we receive semiconductor chips (silicon-based, compound semiconductors, MEMS, etc.) from our customers and carry out assembly and inspection for ceramic packages and other applications. We also have experience in COB (Chip on Board) assembly, where chips are directly mounted onto substrates. 【Features】 - Prototyping is possible, as well as mass production with single processes. - We can handle chips that are difficult to manage and prone to cracking or chipping with care. For more details, please contact us or download the catalog.

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USB isolator

Insulate USB devices with high voltage resistance.

By using the included USB cable to connect the miniB connector side to the PC, insulation can be easily achieved. It also complies with the electrical specifications of USB standards ver1.1/2.0 for full-speed mode (12Mbps) and low-speed mode (1.5Mbps). Its simple design and compact size (35×50×20mm) allow for comfortable use without taking up much space.

  • isolator
  • cable

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Lead Relay Module LRA254 Series

The high voltage-resistant relay has been made into a module with screw terminals.

Since it has four circuits, it can be used with a four-terminal resistance meter. Because it has screw terminals, it can be used in the same way as terminal block type mechanical relays. It can be easily mounted onto a chassis using a DIN rail.

  • relay

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Solar simulator device

No solar panels are needed, and you can easily set the characteristics from your PC.

This device is a solar simulator that can connect up to 32 solar cell simulation power modules with an output of 300W each, allowing for the simulation of high output. Individual settings can be made for each module, such as IV curves, from a PC, enabling the simulation of cell failures and shading.

  • simulator
  • Solar power generator
  • Testing Equipment and Devices

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