Teknek Low Static Board Cleaner 'SMT-II'
Low electrostatic charge, low pressure! It delivers high cleaning performance without damaging the substrate.
The "SMT-II" is a substrate cleaner that removes foreign substances from the substrate before solder printing, operating under low electrostatic and low pressure conditions. In response to the demands for traceability and centralized management in the assembly industry, it is now possible to choose IPC Hermes in addition to SMEMA as standard equipment. Furthermore, all parts of this product are meticulously designed using patented synthetic rubber roller and adhesive roll technology to achieve substrate cleaning in a low electrostatic environment. 【Features】 ■ All parts are meticulously designed using patented synthetic rubber roller and adhesive roll technology to achieve substrate cleaning in a low electrostatic environment. ■ Standard equipment includes IPC-Hermes-9852 or SMEMA to realize centralized management. ■ Simple graphic interface makes operation and settings easy. ■ High cleaning performance without damaging the substrate. ■ "Follow Me" function is available as an option. *For more details, please refer to the PDF materials or feel free to contact us.
- Company:ブルックスジャパン 福岡本社、東京支店
- Price:Other