Cleaning machine Product List and Ranking from 714 Manufacturers, Suppliers and Companies

Last Updated：Nov 19, 2025 Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

Cleaning machine Manufacturer, Suppliers and Company Rankings

Last Updated：Nov 19, 2025 Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

シンショー Hiroshima//Industrial Machinery
ゼストロンジャパン Kanagawa//Chemical
ソマックス Osaka//Industrial Machinery
4 洲本整備機製作所本社工場 Hyogo//Industrial Machinery
5 丸山製作所産機営業部 Tokyo//Industrial Machinery

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Cleaning machine Product ranking

Last Updated：Nov 19, 2025 Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

Basic Knowledge of Flux Cleaning ver.2 [Technical Document] ゼストロンジャパン
Mower "MB Series / MBS Series" 丸山製作所産機営業部
High-pressure washer "5ps・7.5ps Soundproof Type High-pressure Washer" シンショー
4 High-pressure washer "16.5ps・27ps Soundproof High-pressure Washer" シンショー
5 Electric Power Unit Type High Pressure Washer SJME-713SA シンショー

Cleaning machine Product List

1966～1980 item / All 2619 items

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Zestron Japan Co., Ltd. Product Catalog

For cleaning flux on printed circuit boards! A variety of water-based and solvent-based cleaners are available.

This catalog introduces the product lineup of Zestron Japan Co., Ltd. It includes examples of products suitable for situations such as "printed circuit board cleaning" and "package and wafer cleaning," as well as applications and features. We also provide explanations of each product's technology and brand, along with the lineup. Please make use of this information when selecting products. [Contents (partial)] ■ Cleaning process introduction flow ■ Printed circuit board cleaning ■ Flux removal for power electronics ■ Package and wafer cleaning ■ Cleaning of metal masks, screens, and misprinted circuit boards *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
Price：Other

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Manual Circuit Board Cleaner / Quick Cleaning & Drying VIGON EFM

No-clean solder is also effective! Significantly reduces working time in hand-wipe cleaning.

"VIGON EFM" is a hand-wipe cleaning agent that effectively cleans and dries quickly. It significantly reduces the working time for hand-wipe cleaning, with some cases showing a reduction to less than half the time. It is also effective on no-clean solder. It can be used for rework and repair cleaning as well. It is a halogen-free organic solvent that dries quickly and leaves no residue. Furthermore, it is non-corrosive and compatible with most polymers. Please feel free to contact us for inquiries. *For more details, please refer to the PDF document or feel free to reach out to us.

Company：ゼストロンジャパン
Price：Other

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Aiming for coexistence and mutual prosperity with ions: Issues and analytical methods of ion residues [Materials]

The world of electronics at a crossroads! An explanation of the challenges and analysis methods of ion residues using specific examples!

This document explains the issues and analysis methods related to ion residues. Focusing on the complex theme of "ions," it introduces the current challenges that exist. It includes factors contributing to ion residues, the significance of flux cleaning, and specific examples, along with diagrams and detailed explanations, so please feel free to download and take a look. 【Contents (partial)】 ■ Introduction ■ What are ions? ■ Factors of ion residues ■ Significance of flux cleaning ■ Specific examples ■ Cleaning primarily using organic solvents *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
Price：Other

Other electronic parts

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New Challenges in Cleaning: Optimization of Cleaning Methods [Materials]

The evolution of flux cleaning technology is also being questioned! We will publish what issues are at stake.

This document explains flux cleaning in high-performance products. When attempting to establish a cleaning process, we will introduce the issues that arise, taking into account the historical background. We have included images, diagrams, and detailed explanations regarding the ability to handle insoluble substances and the future of soldering cleaning, so please take a moment to read it. 【Contents (partial)】 ■ Introduction ■ Awareness of "Cleaning": Japan's Unique Environment ■ The Rise of Insoluble Substances ■ Ability to Handle Insoluble Substances (MPC Cleaning Agents) ■ The Future of Soldering Cleaning *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
Price：Other

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What is flux residue? Diversification and analysis methods of flux residue.

Cleaning methods and post-cleaning analysis are recent challenges! We will introduce examples of issues caused by flux residues.

Flux residue refers to the residue derived from flux that remains on the workpiece after soldering (contamination), and its components include ions, metal salts, and organic substances. Cleaning paste is formulated with the premise of cleaning, so if left as is, the likelihood of insulation failure due to migration and corrosion increases. Depending on the application, this can also affect human life and infrastructure, making cleaning necessary in some cases. On the other hand, in the case of no-clean paste, the flux residue stabilizes, but the number of cases requiring cleaning for reliability assurance is also increasing. *For detailed content of the column, please refer to the related link. For more information, feel free to contact us.*

Company：ゼストロンジャパン
Price：Other

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Metal mask wipes for hand drying VIGON SC 200

Also serves as an alternative to cleaning with solvent-based spray wipes! Cleanup is simply disposing of the wipe.

We would like to introduce our "Metal Mask Wipes for Hand Drying." These hand wipes excel in cleaning performance, usability, and safety. They can effectively clean hard-to-reach openings with wipes that are impregnated with VIGON SC 200. Additionally, they are characterized by their durability, resistance to tearing, and low linting, making them a highly safe product with no applicable GHS labeling. 【Features】 ■ Excellent cleaning performance, usability, and safety ■ No dripping, with superior drying properties ■ Durable, tear-resistant, and low linting ■ Cleanup involves simply disposing of the wipe *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
Price：Other

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Flux cleaner for printed circuit boards VIGON A 200

Ideal for cleaning low standoff components! Can be introduced into immersion tanks without explosion-proof specifications.

"VIGON A 200" is a water-based cleaning agent specially designed for use in high-pressure and medium-pressure spray equipment, such as inline and batch systems. Based on MPC technology, it is capable of removing various types of flux residues from electronic substrates, ceramic substrates, power modules, and lead frames. It meets high cleanliness requirements for subsequent processes such as wire bonding and coating. 【Features】 - Maintains high cleanliness for wire bonding and coating processes - Free of surfactants and excellent rinsability, leaving no residues on surfaces - Easily filterable, extending liquid life and reducing cleaning agent costs - No flash point, allowing for introduction into immersion tanks without explosion-proof specifications - Does not foam even in high-pressure spray applications - Halogen-free and low odor *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
Price：Other

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Water-based flux cleaner for power semiconductors VIGON PE215N

No ignition point! Prevents re-oxidation of copper substrates with effective rinsing! Long-term protection of activated copper substrates.

"VIGON PE 215N" is a neutral water-based cleaning agent specifically designed for spray cleaning devices. Thanks to MPC technology, it can reliably remove flux residues from power electronics components, making it particularly suitable for cleaning power modules after die attachment and heat sink soldering. Additionally, it excels in material compatibility and the removal of copper oxide films, which enhances the subsequent processes of wire bonding/adhesive bonding and molding, as it is also effective in removing oxide films from copper substrates. 【Features】 ■ Excellent for cleaning flux from power electronics and power modules ■ Provides activated copper substrates for applications such as adhesive bonding ■ pH neutral, with excellent material compatibility with dies, and does not damage passivation ■ No flash point or foaming, making it suitable for spray cleaning machines without explosion-proof specifications *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
Price：Other

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Concentration Measurement Kit / ZESTRON Bath Analyzer 20

Can be used accurately with both new liquids and liquids containing contaminant components! Accurate concentration measurement.

The "ZESTRON Bath Analyzer 20" is a concentration measurement kit for pH neutral cleaning solutions. It comes in a portable case that can be used anywhere, requiring minimal equipment and space. It is simple and easy to use, and can accurately measure concentrations even in solutions containing contaminants. 【Features】 ■ Accurate concentration measurement - Can measure even with increased contaminant levels - Can be used accurately with both new solutions and those containing contaminants ■ Simple and quick usage procedure ■ Comes in a portable case that can be used anywhere ■ Requires minimal equipment and space *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
Price：Other

Other measurement, recording and measuring instruments

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Why is flux cleaning necessary?

Here are some points to consider when contemplating flux cleaning!

Flux cleaning refers to the act of selectively removing substances from the surface of a workpiece (the item being cleaned) that are intended to be eliminated. In other words, flux cleaning means removing flux residues (contaminants) while protecting components such as printed circuit boards, power modules, semiconductor packages, and lead frames. Incidentally, if the removal target includes the work surface and does not have selectivity, it is generally classified as "etching." *For more detailed information, please refer to the related links. For further details, please check the PDF materials or feel free to contact us.*

Company：ゼストロンジャパン
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What is spray (shower) cleaning? The importance and benefits of spray cleaning.

Explaining the principles and features of spray cleaning! Introducing cleaning know-how.

Spray cleaning is a method of cleaning that involves spraying a liquid in a fine mist onto specific objects or surfaces. In this cleaning method, a certain physical force is generated by the flow of liquid ejected at high speed from the nozzle, effectively removing dirt and impurities from the target object. Spray cleaning is easy to adjust in terms of physical force and also excels in liquid replaceability. *For more details, please refer to the related links. For further information, please check the PDF materials or feel free to contact us.*

Company：ゼストロンジャパン
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Examples of technical challenges related to 5G

Behind the scenes of 5G development by the responsible company! Introducing cleaning know-how.

"5G," which has gained even more attention due to the new coronavirus. In Japan, commercial services started in the spring of 2020, and it is said to have an impact not only on mobile phones but also in various fields such as automobiles, industrial equipment, and healthcare. Since it is a technology that has evolved further from 4G, it is easy to imagine that there were many challenges in its development. Curious about the background, I spoke with companies involved in the development of 5G. *For more details, you can view the related links. Please refer to the PDF materials or feel free to contact us for more information.*

Company：ゼストロンジャパン
Price：Other

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Examples of technical challenges related to 5G [Joint Research]

We will introduce an example of how to actually solve the technical challenges associated with 5G!

On this page, we will discuss how to solve the technical challenges associated with 5G, providing an example of a solution. In the previous discussion, we learned that there are cases in 5G-related work where failure can occur if cleaning is not performed. Now, regarding "how to clean," there are important points to consider in the case of 5G work. *For detailed information, please refer to the related links. For more information, please check the PDF materials or feel free to contact us.*

Company：ゼストロンジャパン
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Relationship between implementation components and ion residues [Joint research with Mr. Hiroki]

By selecting cleaning solder paste and flux, you can ensure more reliable cleanliness!

The theme of this discussion is ions, which are essential for electronic devices. However, unintended ions can remain on the device surface, between electrodes, or in low stand-off areas, resulting in "ion residue." Moreover, since these residues can be supplied from various contamination pathways that include not only raw material factors but also environmental factors, achieving a residual amount of zero is technically very challenging. In this instance, we have collaborated with solder manufacturers to assess the ion residue levels for each implemented component. *For more detailed information, please refer to the related links. *The PDF document is a technical resource that explains the issues and analysis methods related to ion residue.

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Price：Other

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Effects of morphological changes in flux residues after soldering on cleanability.

[Joint Research] Joint research on the effects of morphological changes on washability! Detailed explanations and images are presented.

The no-clean solder paste, which continues to evolve, generates significant heat in fields such as 5G devices and high-power devices for electric vehicles (EVs). As environmental burdens increase, it is necessary to pay attention to long-term changes even in stabilized flux residues. Recent market trends have led to the miniaturization of high-performance electronic devices, resulting in reduced distances between components. This, along with the demand for high-speed calculations and increased capacity, has resulted in high currents and voltages. Consequently, even slight flux residues that were previously not problematic can pose various risks, making cleaning necessary in high-reliability devices, even for no-clean flux residues. Together with Mr. Hiroki, who is developing high-performance solder paste, we conducted joint research on the morphological changes of flux residues after soldering and their impact on cleanability. *For more details, please refer to the related links. *The PDF document is a technical material explaining the evolution and challenges of power devices.