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In the field of power semiconductors for automotive and industrial applications, the adoption of "sintering bonding" as a joining technology that achieves high resistance and high reliability against thermal stress is expanding, replacing solder bonding. Similar to no-clean solder bonding technology, sintering bonding is fundamentally designed to be "no-clean." However, the currently mainstream sintering bonding methods are conducted under high temperature and high pressure conditions, which can lead to the generation and adhesion of residues during the bonding process, potentially affecting subsequent processes and long-term reliability. Cleaning is one proposed solution to this issue. Although there is a "no-pressure" method for sintering bonding, its applications tend to be limited from the perspective of strength and reproducibility. Additionally, while it is residue-free, it is not "zero residue," so cleaning can also be a viable solution for achieving reliability. Detailed content of the technical column can be viewed through the related link.

In electronic circuits, the current that flows through unintended paths as envisioned by the designer is called leakage current. This invisible current can significantly impact the reliability, performance, and lifespan of products, making it a critical issue in electronic device development. In today's world, where the miniaturization and high density of semiconductors are accelerating, the sources of leakage current vary widely, ranging from physical limitations within the device to minor issues during the manufacturing process. This article will explain the basics of leakage current, its causes, specific risks at the electronic substrate and assembly levels, countermeasures in the design and manufacturing processes, and methods for addressing it through cleaning and cleanliness evaluation. *For more detailed information, please refer to the related links. Feel free to contact us for further inquiries.*

As electronic devices become more advanced and compact, the importance of fine joint solder paste is increasing in high-reliability fields such as power semiconductors, automotive applications, and industrial equipment. From the perspective of ensuring reliability, there is a growing number of situations where a decision must be made on whether or not to perform flux cleaning, making the cleaning of high-performance solder paste and flux a new challenge. In this research, in collaboration with Japan Superior Co., we focused on the "high-reliability solder paste for fine joints" developed by the company, examining the cleaning characteristics in fine joints and verifying the usefulness of evaluation using FT-IR and SEM-EDS based on chemical analysis. Additionally, we introduce our one-stop technical support that covers everything from cleaning to analysis and process optimization. You can view the detailed content of the article through the related link.