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  6. Evaluation of the cleaning of organic residue remaining after sintering.

Evaluation of the cleaning of organic residue remaining after sintering.

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last updated:Mar 19, 2026

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We conducted a cleaning evaluation using samples created under conditions that are likely to leave residues intentionally!

In the field of power semiconductors for automotive and industrial applications, the adoption of "sintering bonding" as a joining technology that achieves high resistance and high reliability against thermal stress is expanding, replacing solder bonding. Similar to no-clean soldering technology, sintering bonding is fundamentally designed for "no-clean" processes. However, the currently mainstream sintering bonding methods are performed under high temperature and high pressure conditions, which can lead to residues generated and adhered during the bonding process that may affect subsequent processes and long-term reliability. Cleaning is one potential solution to this issue. Although there is a "no-pressure" method for sintering bonding, its applications tend to be limited from the perspective of strength and reproducibility. Additionally, while it is residue-free, it is not "zero residue," so cleaning can also be a viable solution for achieving reliability. *For detailed content of the column, please refer to the related link. For more information, feel free to contact us.*

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Evaluation of the cleaning of organic residue remaining after sintering.

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Cleaning technology required for sintered joint devices [Materials]

Cleaning technology required for sintered joint devices [Materials]

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In the field of power semiconductors for automotive and industrial applications, the adoption of "sintering bonding" as a joining technology that achieves high resistance and high reliability against thermal stress is expanding, replacing solder bonding. Similar to no-clean solder bonding technology, sintering bonding is fundamentally designed to be "no-clean." However, the currently mainstream sintering bonding methods are conducted under high temperature and high pressure conditions, which can lead to the generation and adhesion of residues during the bonding process, potentially affecting subsequent processes and long-term reliability. Cleaning is one proposed solution to this issue. Although there is a "no-pressure" method for sintering bonding, its applications tend to be limited from the perspective of strength and reproducibility. Additionally, while it is residue-free, it is not "zero residue," so cleaning can also be a viable solution for achieving reliability. Detailed content of the technical column can be viewed through the related link.

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Zestron is a global standard "flux cleaning agent manufacturer" based in Germany, with eight locations worldwide. Our cleaning agents are primarily environmentally friendly water-based cleaners that achieve a balance between cleaning performance and safety, while also enabling the reduction of organic solvents, VOCs, and overall usage to lower costs. At our technical center in Kanagawa, customers can choose from inline and batch-type spray cleaning equipment, as well as jet and ultrasonic devices, tailored to their needs, allowing them to test work cleaning under conditions equivalent to those in production environments. In parallel with the cleaning tests, we analyze cleanliness at our analysis center. Utilizing digital microscopes, FT-IR, ion chromatography, and SEM-EDX/EDS, we can detect flux residues that are often overlooked by visual inspection. After the tests are completed, our engineers will provide a technical report detailing recommended processes. *We generally offer support for cleaning process issues free of charge. If you have any requests or challenges related to flux cleaning, please feel free to contact us.

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