Chip coat "Underfill material for flip chips"
High-purity insulating materials for the purpose of sealing semiconductor chips!
The "Underfill for Flip Chip" is a chip coating that is injected and sealed using a capillary flow type in the implementation technology where the circuit surface of an IC chip with metal bump electrodes is directly electrically connected to the mounting substrate side. It is one of the bare chip mounting methods and can accommodate the flip chip technology that is advancing in various applications, including CPUs and graphic LSIs. 【Features】 ■ One of the bare chip mounting methods ■ Insulating material that seals semiconductor chips ■ Capillary flow type *For more details, please refer to the catalog or feel free to contact us.
- Company:ナミックス
- Price:Other