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FPC(めっき) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

FPC Product List

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FPC "Double-sided FPC"

FPC "Double-sided FPC"

It is possible to achieve conductivity on both sides through through-hole plating!

"Double-sided FPC" is a printed circuit board with a base film (insulating substrate) at its center and conductor patterns on both sides. It is mainly used in products such as cameras and mobile LCDs, and it is possible to achieve conductivity on both sides through through-hole plating. [Features] - Conductor patterns on both sides - Capability for conductivity on both sides *For more details, please refer to the catalog or feel free to contact us.

  • Electronic Components
  • Other Machine Parts
  • FPC

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Electroforming technology

Electroforming technology

Ultra-fine processing at the micron level is possible! It is widely applied in fields such as electronic components and semiconductors.

"Electroforming" is a technology that forms metal products with high precision by depositing a nickel plating layer through electroplating. There are three types of cross-sectional shapes to choose from: the "overhang type," where the product is deposited to cover the photoresist; the "straight type," which has a linear thickness direction; and the "laminated type," which consists of multiple layers. It enables ultra-fine processing at the micron level, which is difficult with etching, and is widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field. [Features] - Enables ultra-fine processing at the micron level, which is difficult with etching - Reduces initial costs without the need for molds, allowing for the molding of three-dimensional cross-sectional shapes - Widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • FPC

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Bump-mounted flexible circuit board, FPC, flexible circuit board FPC

Bump-mounted flexible circuit board, FPC, flexible circuit board FPC

It is a flexible circuit board, flexible substrate, and FPC for continuity testing. FPC

A Ci-Ni bump has been formed on the FPC wiring. It is mainly used for bare chip mounting such as flip chip mounting, continuity testing of fine pitch terminals, and as a test jig. FPC

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis
  • FPC

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Support for the launch of flexible printed circuit boards (FPC).

Support for the launch of flexible printed circuit boards (FPC).

Pattern Width VS Temperature Rise Test FPC

●Setting design and evaluation criteria Creating flexible printed circuits (FPC) with multiple pattern widths, applying several patterns of current, and measuring temperature distribution and pattern voltage drop using a thermal viewer. FPC

  • Prototype Services
  • FPC

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Flexible substrate design, manufacturing, and assembly - Flexible circuit boards (FPC)

Flexible substrate design, manufacturing, and assembly - Flexible circuit boards (FPC)

Prototype/Flexible Circuit Board Design Expert

- LED bear chip mounted transparent polyimide substrate - Fine, narrow pitch flexible substrate - Ultra-thin high bend flexible substrate - Shielded noise-resistant flexible substrate - Flying lead flexible substrate - Bump-equipped flexible substrate - Liquid crystal polymer (LCP) flexible substrate - Long flexible substrate - Blind via hole (BVH) connection FPC

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Contract manufacturing
  • FPC

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Printed Circuit Board Pattern Design, Production, Manufacturing - Flexible Circuit Boards (FPC)

Printed Circuit Board Pattern Design, Production, Manufacturing - Flexible Circuit Boards (FPC)

We can accommodate the production of printed circuit boards with various specifications! FPC

- Rigid substrate - Flexible substrate (flexible PCB, FPC) - Rigid-flexible substrate - Impedance controlled substrate - Heat dissipation substrate (thick copper substrate, copper inlay substrate, metal base substrate) - Ceramic substrate (alumina substrate) - Glass substrate - Teflon substrate - Edge through-hole - Cavity substrate - Embedded component substrate - Stretchable flexible substrate FPC

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Contract manufacturing
  • FPC

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Ultra-fine line high-density FPC (high-precision flexible printed circuit board)

Ultra-fine line high-density FPC (high-precision flexible printed circuit board)

Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the integration of MSAP technology and via filling techniques!

The miniaturization and high functionality of electronic devices are advancing, and along with this, there is a demand for finer circuit formation. One method for forming wiring by etching copper foil (subtractive method) and a high-resolution circuit formation method involves forming wiring on ultra-thin copper foil through plating (semi-additive method). The method we are introducing this time is one of the semi-additive processes called "MSAP (Modified Semi Additive Process)." By using the MSAP method, it has become possible to form ultra-fine and high-density patterns that are difficult to achieve with the subtractive method. Additionally, by combining it with the "via filling technology" that fills through-hole holes with copper plating, it becomes possible to create wiring on the through-holes as well, further increasing wiring density. **Features of the MSAP Method** - Circuit formation through plating deposition enables high-precision fine wiring. - Excellent rectangularity of wiring cross-sections contributes to reduced transmission loss. - Superior for high-frequency substrates/IC mounting. By merging these two processing technologies, we have realized "ultra-fine high-density FPC." #FlexibleSubstrate #Substrate #HighPrecisionSubstrate #Flex #FlexiblePrintedCircuitBoard

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • FPC

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Design and manufacture of manufacturing tools, flexible circuit boards, flexible substrates, FPC.

Design and manufacture of manufacturing tools, flexible circuit boards, flexible substrates, FPC.

We handle the design, manufacturing, and procurement of peripheral components for printed circuit boards, saving development personnel time! FPC

- High heat-resistant membrane switch - Procurement of various tools used in the manufacturing process - Procurement of electronic components - Design and procurement of assembly jigs (inspection jigs/pallets, etc.) - Design and procurement of resin and metal cases (machining/3D printing) - Proposal and sales of JTAG boundary scan test systems - Manufacturing and sales of membrane switches - Manufacturing and sales of dedicated function testers - Manufacturing and sales of custom sockets - Manufacturing and sales of cables FPC

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis
  • FPC

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[CT.Lab] Research and Development Support Flexible Substrates, Flexible Boards, FPC

[CT.Lab] Research and Development Support Flexible Substrates, Flexible Boards, FPC

Combining specialized design, next-generation materials, and the latest wiring technology to create new added value.

- Thin film formation and contract processing services - Special metal material patterning technology (Ag, Sn, Pt, Nb, Ni-Pd-Au, etc.) - Ultra-fine processing for MEMS/semiconductors - Research and development of high heat-resistant membrane switches - Development of flexible substrates using transparent polyimide and stretchable materials - Material development using fluororesin

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Contract manufacturing
  • FPC

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[Support for Improving Development Capability] Flexible Circuit Boards, FPC, Flexible Boards FPC

[Support for Improving Development Capability] Flexible Circuit Boards, FPC, Flexible Boards FPC

We will support and propose ideas to the development technology personnel to further enhance development capabilities! FPC

- Circuit board analysis services (circuit investigation, component investigation, specification investigation, etc.) - Reliability and environmental testing services - Consulting services (thermal analysis and countermeasure development, FPC startup support) - Proposal and sales of development and production support tools (JTAG boundary scan test system) - Proposal for test coupon development for FPC Resin, metal cutting,

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis
  • FPC

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