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FPC Product List

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TTL Analog circuit development support service, assistance with circuit design.

TTL Analog circuit development support service, assistance with circuit design.

Over 1,000 development achievements! Assisting in environmental measures through the promotion of electrification and efficiency improvements in power circuits.

Do you have any concerns regarding circuit design? Taiyo Techno-Rex is currently strengthening our support for issues related to circuit boards. We invite you to take a look at our catalog, and we look forward to your inquiries. - Brushless motor control - Stepper motor control - DC-DC power circuits - AC-DC power circuits - Custom power development * We also flexibly respond to efficiency improvements and miniaturization of existing power supplies. #CircuitDesign #PowerCircuits #MotorControl #ControlBoards #AnalogCircuitDesign #CircuitDesignSupport

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  • Circuit board design and manufacturing
  • FPC

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MSAP FPC (Ultra-fine Circuit High-Frequency Flexible Substrate)

MSAP FPC (Ultra-fine Circuit High-Frequency Flexible Substrate)

Formation of fine circuits using the MSAP method.

Yamashita Material's MSAP (Modified Semi-Additive Process) is a high-precision method for forming fine copper wiring on polyimide substrates. Compared to traditional subtractive methods, it has less distortion in pattern shapes due to etching, allowing for the formation of higher-density circuits. It is suitable for FPC applications that require miniaturization, high density, and fine wiring.

  • Circuit board design and manufacturing
  • FPC

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Ultra-fine line high-density FPC (high-precision flexible printed circuit board)

Ultra-fine line high-density FPC (high-precision flexible printed circuit board)

Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the integration of MSAP technology and via filling techniques!

The miniaturization and high functionality of electronic devices are advancing, and along with this, there is a demand for finer circuit formation. One method for forming wiring by etching copper foil (subtractive method) and a high-resolution circuit formation method involves forming wiring on ultra-thin copper foil through plating (semi-additive method). The method we are introducing this time is one of the semi-additive processes called "MSAP (Modified Semi Additive Process)." By using the MSAP method, it has become possible to form ultra-fine and high-density patterns that are difficult to achieve with the subtractive method. Additionally, by combining it with the "via filling technology" that fills through-hole holes with copper plating, it becomes possible to create wiring on the through-holes as well, further increasing wiring density. **Features of the MSAP Method** - Circuit formation through plating deposition enables high-precision fine wiring. - Excellent rectangularity of wiring cross-sections contributes to reduced transmission loss. - Superior for high-frequency substrates/IC mounting. By merging these two processing technologies, we have realized "ultra-fine high-density FPC." #FlexibleSubstrate #Substrate #HighPrecisionSubstrate #Flex #FlexiblePrintedCircuitBoard

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • FPC

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[Support for Improving Development Capability] Flexible Circuit Boards, FPC, Flexible Boards FPC

[Support for Improving Development Capability] Flexible Circuit Boards, FPC, Flexible Boards FPC

We will support and propose ideas to the development technology personnel to further enhance development capabilities! FPC

- Circuit board analysis services (circuit investigation, component investigation, specification investigation, etc.) - Reliability and environmental testing services - Consulting services (thermal analysis and countermeasure development, FPC startup support) - Proposal and sales of development and production support tools (JTAG boundary scan test system) - Proposal for test coupon development for FPC Resin, metal cutting,

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis
  • FPC

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chemSHERPA Creation Service FPC

chemSHERPA Creation Service FPC

Proposal for outsourcing the investigation of environmental burden substances to reduce operational burden: chemSHERPA RoHS REACH TSCA non-use certificate FPC.

At Satec, we handle everything from investigating the chemical substances contained in used parts to creating environmental impact data for products. We conduct survey requests to suppliers (agents/manufacturers) on behalf of our customers and create chemSHERPA data. We assist developers in reducing their workload, which they manage alongside their primary tasks (circuit design and operation verification). FPC Flexible circuit boards, flex boards, FPC, flex, rigid-flex High heat resistance, membrane switches, flexible circuit boards, flex, FPC, printed circuit boards, Flexible circuit boards, flex boards, FPC, flex, Hamamatsu City, Board design, boards, printed circuit boards, pattern design, assembly, SMD assembly, board analysis, circuit design, software, hardware, Electronic circuit design, rigid-flex, heat dissipation boards, Specialty boards, stretchable boards, transparent polyimide, polyimide, MEMS, chemSHERPA

  • Circuit board design and manufacturing
  • Other contract services
  • Catalog and manual creation
  • FPC

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Multilayer FPC (multilayer substrate, multilayer flexible printed circuit board)

Multilayer FPC (multilayer substrate, multilayer flexible printed circuit board)

We will manufacture multi-layer flexible printed circuit boards (3 to 6 layers) entirely from polyimide. Please look forward to our quick delivery response! (Multi-layer boards, FPC)

Taiyo Industry supports everything from prototyping to mass production. ■ Achieves high density through pad-on-bead technology. ■ Compatible with 400μm pitch BGA. ■ Improved design flexibility with multilayer structures for high-density wiring. ■ Also supports impedance management. For more detailed information, please feel free to contact our representative. #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance

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  • Other electronic parts
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • FPC

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Design and manufacture of manufacturing tools, flexible circuit boards, flexible substrates, FPC.

Design and manufacture of manufacturing tools, flexible circuit boards, flexible substrates, FPC.

We handle the design, manufacturing, and procurement of peripheral components for printed circuit boards, saving development personnel time! FPC

- High heat-resistant membrane switch - Procurement of various tools used in the manufacturing process - Procurement of electronic components - Design and procurement of assembly jigs (inspection jigs/pallets, etc.) - Design and procurement of resin and metal cases (machining/3D printing) - Proposal and sales of JTAG boundary scan test systems - Manufacturing and sales of membrane switches - Manufacturing and sales of dedicated function testers - Manufacturing and sales of custom sockets - Manufacturing and sales of cables FPC

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis
  • FPC

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Bump-mounted flexible circuit board, FPC, flexible circuit board FPC

Bump-mounted flexible circuit board, FPC, flexible circuit board FPC

It is a flexible circuit board, flexible substrate, and FPC for continuity testing. FPC

A Ci-Ni bump has been formed on the FPC wiring. It is mainly used for bare chip mounting such as flip chip mounting, continuity testing of fine pitch terminals, and as a test jig. FPC

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis
  • FPC

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Support for the launch of flexible printed circuit boards (FPC).

Support for the launch of flexible printed circuit boards (FPC).

Pattern Width VS Temperature Rise Test FPC

●Setting design and evaluation criteria Creating flexible printed circuits (FPC) with multiple pattern widths, applying several patterns of current, and measuring temperature distribution and pattern voltage drop using a thermal viewer. FPC

  • Prototype Services
  • FPC

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Flexible substrate design, manufacturing, and assembly - Flexible circuit boards (FPC)

Flexible substrate design, manufacturing, and assembly - Flexible circuit boards (FPC)

Prototype/Flexible Circuit Board Design Expert

- LED bear chip mounted transparent polyimide substrate - Fine, narrow pitch flexible substrate - Ultra-thin high bend flexible substrate - Shielded noise-resistant flexible substrate - Flying lead flexible substrate - Bump-equipped flexible substrate - Liquid crystal polymer (LCP) flexible substrate - Long flexible substrate - Blind via hole (BVH) connection FPC

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Contract manufacturing
  • FPC

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Printed Circuit Board Pattern Design, Production, Manufacturing - Flexible Circuit Boards (FPC)

Printed Circuit Board Pattern Design, Production, Manufacturing - Flexible Circuit Boards (FPC)

We can accommodate the production of printed circuit boards with various specifications! FPC

- Rigid substrate - Flexible substrate (flexible PCB, FPC) - Rigid-flexible substrate - Impedance controlled substrate - Heat dissipation substrate (thick copper substrate, copper inlay substrate, metal base substrate) - Ceramic substrate (alumina substrate) - Glass substrate - Teflon substrate - Edge through-hole - Cavity substrate - Embedded component substrate - Stretchable flexible substrate FPC

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Contract manufacturing
  • FPC

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[CT.Lab] Research and Development Support Flexible Substrates, Flexible Boards, FPC

[CT.Lab] Research and Development Support Flexible Substrates, Flexible Boards, FPC

Combining specialized design, next-generation materials, and the latest wiring technology to create new added value.

- Thin film formation and contract processing services - Special metal material patterning technology (Ag, Sn, Pt, Nb, Ni-Pd-Au, etc.) - Ultra-fine processing for MEMS/semiconductors - Research and development of high heat-resistant membrane switches - Development of flexible substrates using transparent polyimide and stretchable materials - Material development using fluororesin

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Contract manufacturing
  • FPC

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150°C Compatible High-Temperature FPC for Automotive Equipment

150°C Compatible High-Temperature FPC for Automotive Equipment

The upper limit of operating temperature has significantly increased from 105°C to 150°C, enabling use in high-temperature environments such as automotive and industrial equipment applications.

In recent years, the demand for FPC (Flexible Printed Circuit) has been increasing in high-temperature processing applications such as automotive uses. To withstand higher temperature environments, it was necessary to improve the adhesive joints of the insulating layer that protects the circuit board, in order to prevent delamination of the insulating layer. High-temperature resistant FPC has achieved long-term reliability even in environments of 150°C by enhancing the heat resistance of the adhesive layer in the coverlay film that protects the surface of the FPC. Additionally, when combined with our 150°C compatible FPC connector HF601 series, it enables use in high-temperature environments of up to 150°C. ■ Features - Long-term reliability secured at 150°C for 3,000 hours - FPC layer configuration: single-sided (1 layer), double-sided (2 layers) - Compatible with two types of substrates: LCP material (YFA: single-sided, YFB: double-sided), PI material (YFH: single-sided) - Component mounting possible - With a GND reinforcement design, it can be used not only for high-temperature FPC applications but also as noise resistance. - Both FPC and connectors can be provided as a set of 150°C compatible products.

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  • Wiring materials
  • FPC

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EMS - Comprehensive Contracting Services

EMS - Comprehensive Contracting Services

One-stop service for FPC design, manufacturing, implementation, and finished product assembly all provided by Taiyo Technorex!

We will support the resolution of challenges in your product development and manufacturing in a broader and more flexible manner. ★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜ 　☆ ～ ☆ ～ Do you have any of the following concerns? ～☆ ～ ☆ 　　• Looking for a reliable manufacturing partner for new product development 　　• Considering outsourcing as you do not have a manufacturing line 　　• Wanting to request complex board assembly and enclosure assembly, including FPC ★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜ Our company has established a system that can consistently handle everything from design to implementation, assembly, inspection, and shipping, and we support the resolution of challenges in your product development and manufacturing in a broader and more flexible manner. You will be able to focus on development while efficiently bringing high-quality products to market. If you would like detailed materials or case studies about our EMS business, please feel free to contact us. We also welcome those who just want to take a look at the materials!

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  • Circuit board design and manufacturing
  • EMS
  • FPC

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【For industrial equipment】150℃ compatible high heat-resistant FPC

【For industrial equipment】150℃ compatible high heat-resistant FPC

The upper limit of operating temperature has significantly increased from 105°C to 150°C, enabling use in high-temperature environments, including automotive and industrial equipment applications.

In recent years, the demand for FPC (Flexible Printed Circuit) has been increasing in high-temperature processing applications such as automotive uses. To withstand higher temperature environments, it was necessary to improve the adhesive joints of the insulating layer that protects the circuit board, in order to prevent delamination of the insulating layer. High-temperature resistant FPC has achieved long-term reliability even in environments of 150°C by enhancing the heat resistance of the adhesive layer in the coverlay film that protects the surface of the FPC. Additionally, when used in combination with our 150°C rated FPC connector HF601 series, it enables use in high-temperature environments up to 150°C. ■ Features - Long-term reliability ensured at 150°C for 3,000 hours - FPC layer configuration: single-sided (1 layer), double-sided (2 layers) - Two types of substrates available: LCP material (YFA: single-sided, YFB: double-sided), PI material (YFH: single-sided) - Component mounting possible - With a GND reinforcement design, it can be used not only for high-temperature FPC applications but also as noise resistance. - Both FPC and connectors can be provided as a set of 150°C rated products.

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  • Wiring materials
  • FPC

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Supports high temperatures of 150℃! Suitable for use in automotive and high-temperature environments FPC.

Supports high temperatures of 150℃! Suitable for use in automotive and high-temperature environments FPC.

Securing long-term reliability at 150℃ for 3,000 hours.

In recent years, the demand for FPC (Flexible Printed Circuit) has been increasing in high-temperature processing applications such as automotive uses. To withstand higher temperature environments, it was necessary to improve the adhesive joints of the insulating layer that protects the circuit board, in order to prevent delamination of the insulating layer. High-temperature resistant FPC has achieved long-term reliability even in environments of 150°C by enhancing the heat resistance of the adhesive layer in the coverlay film that protects the surface of the FPC. Additionally, when combined with our 150°C compatible FPC connector HF601 series, it enables usage in high-temperature environments up to 150°C. ■Features - Long-term reliability secured at 150°C for 3,000 hours - FPC layer configuration: single-sided (1 layer), double-sided (2 layers) - Two types of substrates available: LCP material (YFA: single-sided, YFB: double-sided), PI material (YFH: single-sided) - Component mounting possible - With a GND reinforcement design, it can be used not only for high-temperature FPC applications but also as noise resistance. - Both FPC and connectors can be provided as a set of 150°C compatible products.

  • HF601-xx-02_YFLEX嵌合.jpg
  • イプロス_高耐熱FPC_信頼性評価項目_一覧表.png
  • Wiring materials
  • FPC

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