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FPC(実装) - List of Manufacturers, Suppliers, Companies and Products

FPC Product List

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High elongation FPC (Flexible Printed Circuit)

Supports over 50% elongation! There are various applications such as wearable electronic devices and robots.

The "High Stretch FPC" uses copper circuits for fine circuits and electronic component mounting, and is designed for low-temperature soldering of electronic components. For areas that require stretching, elastic conductive materials are used, accommodating stretches of over 50%. By innovating the circuit shape of the elastic conductive materials and using our smart metal masks for thick film printing, it is possible to suppress changes in resistance values. 【Features】 ■ Compatible with low-temperature soldering of electronic components ■ Accommodates stretches of over 50% ■ Capable of suppressing changes in resistance values *For more details, please refer to the PDF document or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #ShortLeadTime #MassProduction

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  • Other electronic parts

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Transparent FPC (Transparent Flexible Printed Circuit Board)

Transparent flexible printed circuit boards contribute to improved design with excellent transparency! The fine patterns make the wiring inconspicuous.

〇Uses polyimide with excellent heat resistance and flame retardancy. ⇒【Compatible with reflow mounting】 ★ For display devices such as digital signage, as well as medical devices and transparent film antennas! ★ We also accommodate small quantities and a variety of prototypes. For more detailed information, please contact us. #Transparent #Transparent FPC #Transparent Flex

  • Other electronic parts

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Ultra-fine line high-density FPC (high-precision flexible printed circuit board)

Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the integration of MSAP technology and via filling techniques!

The miniaturization and high functionality of electronic devices are advancing, and along with this, there is a demand for finer circuit formation. One method for forming wiring by etching copper foil (subtractive method) and a high-resolution circuit formation method involves forming wiring on ultra-thin copper foil through plating (semi-additive method). The method we are introducing this time is one of the semi-additive processes called "MSAP (Modified Semi Additive Process)." By using the MSAP method, it has become possible to form ultra-fine and high-density patterns that are difficult to achieve with the subtractive method. Additionally, by combining it with the "via filling technology" that fills through-hole holes with copper plating, it becomes possible to create wiring on the through-holes as well, further increasing wiring density. **Features of the MSAP Method** - Circuit formation through plating deposition enables high-precision fine wiring. - Excellent rectangularity of wiring cross-sections contributes to reduced transmission loss. - Superior for high-frequency substrates/IC mounting. By merging these two processing technologies, we have realized "ultra-fine high-density FPC." #FlexibleSubstrate #Substrate #HighPrecisionSubstrate #Flex #FlexiblePrintedCircuitBoard

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  • Printed Circuit Board
  • Circuit board design and manufacturing

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