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We will assist you with the design of various ultra-fine/thin/small FPC needs.
By adopting high-quality ultra-fine/thin/small FPCs, we enhance miniaturization and thinness to the extreme, expanding the design flexibility for wearable devices, medical equipment, sensors, and more.
The upper limit of operating temperature has significantly increased from 105°C to 150°C, enabling use in high-temperature environments such as automotive and industrial equipment applications.
In recent years, the demand for FPC (Flexible Printed Circuit) has been increasing in high-temperature processing applications such as automotive uses. To withstand higher temperature environments, it was necessary to improve the adhesive joints of the insulating layer that protects the circuit board, in order to prevent delamination of the insulating layer. High-temperature resistant FPC has achieved long-term reliability even in environments of 150°C by enhancing the heat resistance of the adhesive layer in the coverlay film that protects the surface of the FPC. Additionally, when combined with our 150°C compatible FPC connector HF601 series, it enables use in high-temperature environments of up to 150°C. ■ Features - Long-term reliability secured at 150°C for 3,000 hours - FPC layer configuration: single-sided (1 layer), double-sided (2 layers) - Compatible with two types of substrates: LCP material (YFA: single-sided, YFB: double-sided), PI material (YFH: single-sided) - Component mounting possible - With a GND reinforcement design, it can be used not only for high-temperature FPC applications but also as noise resistance. - Both FPC and connectors can be provided as a set of 150°C compatible products.
Prototype/Flexible Circuit Board Design Expert
- LED bear chip mounted transparent polyimide substrate - Fine, narrow pitch flexible substrate - Ultra-thin high bend flexible substrate - Shielded noise-resistant flexible substrate - Flying lead flexible substrate - Bump-equipped flexible substrate - Liquid crystal polymer (LCP) flexible substrate - Long flexible substrate - Blind via hole (BVH) connection FPC
We will manufacture multi-layer flexible printed circuit boards (3 to 6 layers) entirely from polyimide. Please look forward to our quick delivery response! (Multi-layer boards, FPC)
Taiyo Industry supports everything from prototyping to mass production. ■ Achieves high density through pad-on-bead technology. ■ Compatible with 400μm pitch BGA. ■ Improved design flexibility with multilayer structures for high-density wiring. ■ Also supports impedance management. For more detailed information, please feel free to contact our representative. #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance
The upper limit of operating temperature has significantly increased from 105°C to 150°C, enabling use in high-temperature environments, including automotive and industrial equipment applications.
In recent years, the demand for FPC (Flexible Printed Circuit) has been increasing in high-temperature processing applications such as automotive uses. To withstand higher temperature environments, it was necessary to improve the adhesive joints of the insulating layer that protects the circuit board, in order to prevent delamination of the insulating layer. High-temperature resistant FPC has achieved long-term reliability even in environments of 150°C by enhancing the heat resistance of the adhesive layer in the coverlay film that protects the surface of the FPC. Additionally, when used in combination with our 150°C rated FPC connector HF601 series, it enables use in high-temperature environments up to 150°C. ■ Features - Long-term reliability ensured at 150°C for 3,000 hours - FPC layer configuration: single-sided (1 layer), double-sided (2 layers) - Two types of substrates available: LCP material (YFA: single-sided, YFB: double-sided), PI material (YFH: single-sided) - Component mounting possible - With a GND reinforcement design, it can be used not only for high-temperature FPC applications but also as noise resistance. - Both FPC and connectors can be provided as a set of 150°C rated products.
Securing long-term reliability at 150℃ for 3,000 hours.
In recent years, the demand for FPC (Flexible Printed Circuit) has been increasing in high-temperature processing applications such as automotive uses. To withstand higher temperature environments, it was necessary to improve the adhesive joints of the insulating layer that protects the circuit board, in order to prevent delamination of the insulating layer. High-temperature resistant FPC has achieved long-term reliability even in environments of 150°C by enhancing the heat resistance of the adhesive layer in the coverlay film that protects the surface of the FPC. Additionally, when combined with our 150°C compatible FPC connector HF601 series, it enables usage in high-temperature environments up to 150°C. ■Features - Long-term reliability secured at 150°C for 3,000 hours - FPC layer configuration: single-sided (1 layer), double-sided (2 layers) - Two types of substrates available: LCP material (YFA: single-sided, YFB: double-sided), PI material (YFH: single-sided) - Component mounting possible - With a GND reinforcement design, it can be used not only for high-temperature FPC applications but also as noise resistance. - Both FPC and connectors can be provided as a set of 150°C compatible products.
